Rotational angle sensor and method manufacturing same, and throttle control device with rotational angle sensor

ABSTRACT

A rotational angle sensor and a method for manufacturing the same, and a throttle control device with a rotational angle sensor, which may lower the cost, are provided. The rotational angle sensor includes each sensor IC for detecting a rotational angle of a rotor based on a magnetic field generated between a pair of magnets respectively disposed across the rotational axis of the rotor; each main terminal connected with each connection terminal of each sensor IC; and a holder member for holding each sensor IC and connection portions of each main terminal on each sensor side. A sensor assembly is constructed to form the sensor ICs the main terminals and the holder member into an assembly. A potting material is potted into the holder member.

This application is a continuation of application Ser. No. 10/587,843,filed on Mar. 1, 2007, 2006 now U.S. Pat. No. 8,044,659, which is a 371of PCT/JP2005/001227, filed on Jan. 28, 2005, both of which areincorporated herein by reference.

TECHNICAL FIELD

The present invention relates to a rotational angle sensor and a methodfor manufacturing the same, and a throttle control device with arotational angle sensor.

BACKGROUND ART

Some electronically-control-type throttle control devices used forcontrolling an intake air flow into an engine of such as an automobileinclude rotational angle sensors serving as throttle sensors fordetecting a rotational angle of a motor shaft of an electric motor,which drives a throttle valve (see Patent Document 1 for example).

Some rotational angle sensors used for these throttle control devicesinclude magnetic detectors for detecting a rotational angle of a rotorbased on a magnetic field generated between a pair of magnetsrespectively disposed across the rotational axis of the rotor, and aprinted circuit board electrically connected with each connectionterminal of the magnetic detectors (see Patent Document 2 for example).

Further, others include magnetic detectors for detecting a rotationalangle of a rotor based on magnetic fields generated between a pair ofmagnets respectively disposed across the rotational axis of the rotor,in which the respective connection terminals are connected withmagnetic-detector-side connections of each wiring terminal (equivalentto terminals integrally formed with main terminals and subterminalsherein), which can connect terminal pins of external connectors, in sucha manner that the respective wiring terminals and the magnetic detectorare integrated by integrally resin molding (see Patent Document 3 forexample).

-   Patent Document 1: Japanese Laid-Open Patent Publication No.    6-264777-   Patent Document 2: Japanese Laid-Open Patent Publication No.    2003-57071-   Patent Document 3: Japanese Laid-Open Patent Publication No.    2003-289610

According to the rotational angle sensors of the aforementioned PatentDocument 2, the problem has been that using a printed circuit board,which is generally perceived as expensive, forces the cost to beincreased.

Further, according to the rotational angle sensors of Patent Document 3,the problem has been that a die for integrally resin molding (primarymolding) the magnetic detector and each wiring terminal is required,which increases equipment expenses, thereby to force the overall cost tobe increased.

SUMMARY OF THE INVENTION

A problem to be solved by the present invention is to provide arotational angle sensor and a method for manufacturing the same, and athrottle control device with a rotational angle sensor, which may lowerthe cost.

The aforementioned problem can be solved by a rotational angle sensorand a method for manufacturing the same, and a throttle control devicewith a rotational angle sensor, within the gist of the constructionsdescribed in the claims.

Thus, a first invention is a rotational angle sensor including amagnetic detector for detecting a rotational angle of a rotor based on amagnetic field generated between a pair of magnets respectively disposedacross the rotational axis of the rotor, each main terminal connectedwith each connection terminal of the magnetic detector, and a holdermember for holding the magnetic detector and magnetic-detector-sideconnection portions of the main terminals, in which the magneticdetector, the main terminals and the holder member are formed into anassembly to be constructed as a sensor assembly. According to the firstinvention constructed as above, each connection terminal of the magneticdetector for detecting a rotational angle of a rotor is connected toeach main terminal. Therefore, it is possible to lower the cost by usinginexpensive main terminals, comparing to expensive printed circuitboards that have conventionally been required. Further, inserting themagnetic detector and the magnetic-detector-side connection portions ofeach main terminal into the holder member may eliminate a molding diefor integrally resin molding the conventional magnetic detector and eachwiring terminal (see Patent Document 3). Accordingly, it is possible toreduce the equipment expenses so as to lower the cost. Further,constructing a sensor assembly, which forms the magnetic detector, themain terminals and the holder member into an assembly, facilitateshandling the magnetic detector and the main terminals. Further, it ispossible to reduce the size of the sensor assembly, because thestructure is more simplified than in using a printed circuit board.Accordingly, it is possible to reduce the equipment expenses so as tolower the cost.

Further, a second invention is the rotational angle sensor as in thefirst invention, in which each connection terminal of the magneticdetector and the respective main terminals are connected by welding.According to the second invention constructed as above, each connectionterminal of the magnetic detector and each main terminal are connectedby welding. Thus, since the strength of the connection between eachconnection terminal of the magnetic detector and each main terminal isenhanced, it is possible to prevent or reduce disconnection caused byrepeated temperature cycles. Additionally, it is possible to increasethe reliability of the rotational angle sensor.

Further, a third invention is the rotational angle sensor as in thefirst or the second invention, in which the holder member is providedwith guiding portions for guiding the magnetic detector to apredetermined assembled position. According to the third inventionconstructed as above, the guiding portions provided in the holder membermay guide the magnetic detector to a predetermined assembled position.Thus, the magnetic detector can be easily and accurately assembled inthe predetermined assembled position within the holder member. Thus, itis possible to facilitate assembling the magnetic detector and increasethe detection accuracy and the reliability of the rotational anglesensor.

Further, a fourth invention is the rotational angle sensor as in any oneof the first to the third inventions, in which a potting material ispotted into the holder member so as to cover the magnetic detector andthe connection portions between each connection terminal of the magneticdetector and the respective main terminals. According to the fourthinvention constructed above, a potting material is potted into theholder member so as to cover the magnetic detector and the connectionportions between each connection terminal of the magnetic detector andthe respective main terminals. Thus, it is possible to prevent theintrusion of moisture to the electrically conductive portions so as toprevent or reduce the occurrence of shunt or short and migration.Additionally, when the potting material has flexibility, it is possibleto protect the magnetic detector from thermal stress, vibrations and thelike. Additionally, since no excess pressure is applied to the magneticdetector when it is potted, it is possible to avoid characteristicchanges of the magnetic detector caused by the pressure. For thesereasons, it is possible to increase the reliability of the rotationalangle sensor. Further, when a printed circuit board is used, coveringthe printed circuit board requires plenty of potting material, butconversely, covering or molding the connection portions between eachconnection terminal of the magnetic detector and each main terminal witha potting material within a space surrounded by the holder memberreduces the potting material used such that it is possible to lower thematerial cost for the potting material. Further, unlike in the case ofintegrally resin molding (primary molding) the magnetic detector andeach wiring terminal (equivalent to a terminal integrally formed by amain terminal and a subterminal herein), it is possible to reduce theequipment expenses for a resin molding die so as to lower the cost.Further, it is possible to prevent or reduce defective moldings due to adisplacement between the magnetic detector and each main terminal causedby molding pressure in resin molding, a deformation of each connectionterminal of the magnetic detector and each main terminal and the like.

Further, a fifth invention is the rotational angle sensor as in thefourth invention, in which the rotational angle sensor is provided withcapacitors as a preventive measure for discharge of positive charges,and the capacitors are connected between one and another of therespective main terminals and covered with the potting material.According to the fifth invention constructed as above, the capacitors asa preventive measure for discharge of positive charges are connectedbetween one and another of the respective main terminals and coveredwith the potting material. Thus, the potting material may protect thecapacitors from thermal stress, vibrations and the like. Further, sinceno excess pressure is applied to the capacitors when they are potted, itis possible to avoid disconnection, destruction and the like of thecapacitors caused by the pressure. Accordingly, it is possible toincrease the reliability of the rotational angle sensor.

Further, a sixth invention is the rotational angle sensor as in thefifth invention, in which the capacitors are disposed on the same sideas the connection side of the respective main terminals connected withthe magnetic detector. According to the sixth invention constructed asabove, the capacitors are disposed on the same side as the connectionside of the respective main terminals connected with the magneticdetector. Thus, it is possible to facilitate disposing the magneticdetector and the capacitors with respect to each main terminal.

Further, a seventh invention is the rotational angle sensor as in thefifth and sixth inventions, in which housed portions of the respectivemain terminals for connecting the magnetic detectors and the capacitorsare formed in stepped manner with exposed portions of the respectivemain terminals for the external terminals, such that the exposedportions are disposed outside of the holder member, while the housedportions are housed with the magnetic detector and the capacitors in theholder member in such a manner that the housed portions are closer tothe bottom in the holder member than the exposed portions. According tothe seventh invention constructed as above, the housed portions of eachmain terminal for connecting the magnetic detectors and the capacitorsare formed in stepped manner with exposed portions of each main terminalfor the external terminals, such that the exposed portions are disposedoutside of the holder member, while the housed portions are housed withthe magnetic detector and the capacitors in the holder member in such amanner that the housed portions are closer to the bottom in the holdermember than the exposed portions. Thus, it is possible to easily andsecurely pot the potting material against portions that need to bewater-resistant for electrically conductive portions including themagnetic detectors and the capacitors. Accordingly, it is possible toprevent or reduce the occurrence of short caused in electricallyconductive portions.

Further, an eighth invention is the rotational angle sensor as in thefifth to the seventh inventions, in which the capacitors are lead-typecapacitors having leads. According to the eighth invention constructedas above, the capacitors are lead-type capacitors having leads. Thus,the leads of the capacitors can be retained by a jig for retaining themain terminals etc. Thus, since the capacitors are positioned, it ispossible to prevent or reduce connection failures caused by displacementof the capacitors.

Further, a ninth invention is the rotational angle sensor of the eighthinvention, in which the leads of the capacitors are connected with thecapacitor connections of the main terminals by welding. According to theninth invention constructed as above, the leads of the capacitors areconnected with the capacitor connections of the main terminals bywelding. Thus, since the strength of the connection between the leads ofthe capacitors and the capacitor connections of the main terminals isenhanced, it is possible to increase the reliability of the rotationalangle sensor. Further, compared with soldering in a reflow furnace,welding enables simple welding facilities to be used without having touse an expensive reflow furnace, so as to lower the cost. Further,soldering might cause connection failures due to uneven amount ofsolder, while welding can securely connect the leads of the capacitorswith the capacitor connections of the main terminals.

Further, a tenth invention is the rotational angle sensor as in thefourth invention, in which the magnetic detectors are housed in theholder member such that a bottom surface within the holder member isformed in a predetermined spaced relationship to the contour shape ofthe magnetic detectors facing to the bottom surface. According to thetenth invention constructed as above, the bottom surface within theholder member is formed in a predetermined spaced relationship to thecontour shape of the magnetic detectors facing to the bottom surface.Thus; a potting material can easily flow into a gap between the bottomsurface within the holder member and the magnetic detectors, i.e., aregion prone to voids when the potting material is potted, such that itis possible to inhibit void generation so as to prevent or reducedefective moldings.

Further, an eleventh invention is the rotational angle sensor of any oneof the first to the tenth inventions, in which the rotational anglesensor is provided with a resin molded body, which is resin molded insuch a manner that the sensor assembly is insert molded withsubterminals, which are connected to the terminal connections of therespective main terminals and connectable with terminal pins of anexternal connector. According to the eleventh invention constructed asabove, a resin molded body is provided, which is resin molded in such amanner that the sensor assembly is insert molded with subterminals,which are connected to the terminal connections of the respective mainterminals and connectable with terminal pins of an external connector.Thus, it is possible to easily dispose the sensor assembly and thesubterminals to the resin molded body. Further, since the main terminalsand the subterminals of the sensor assembly are configured to beconnected, it is possible to use a common sensor assembly for resinmolded bodies different in the connection positions and the connectiondirections of the external connector, the wire routings of thesubterminals and the like.

Further, a twelfth invention is the rotational angle sensor as in theeleventh invention, in which the holder member includes sidewalls, whichis provided with reinforcing ribs for inhibiting deformation of thesidewalls caused by molding pressure when the resin molded body is resinmolded. According to the twelfth invention constructed as above, thereinforcing ribs provided on the sidewalls included in the holder membercan inhibit deformation of the sidewalls caused by molding pressure whenthe resin molded body is resin molded. Thus, it is possible to preventor reduce defective moldings caused by deformation of the sidewalls ofthe holder member when molding pressure is applied during the resinmolding of the resin molded body.

Further, a thirteenth invention is the rotational angle sensor of theeleventh or the twelfth invention, in which the holder member isprovided on an outer surface thereof with a stepped surface intersectingan axis such that a resin portion of the resin molded body surroundingthe holder member is prevented from burring on the same plane as thestepped surface. According to the thirteenth invention constructed asabove, the resin portion of the resin molded body surrounding the holdermember is prevented from burring on the game plane as the steppedsurface. Thus, it is possible to inhibit burr generation, while highdimensional accuracy is not required between the holder member and theresin molding die for the resin-molded body. Therefore, it is possibleto lower the cost for ensuring the dimensional accuracy of the holdermember.

Further, a fourteenth invention is the rotational angle sensor as in thethirteenth invention, in which the stepped surface of the holder memberis provided with retaining recesses, into which the resin portion of theresin molded body flows. According to the fourteenth inventionconstructed as above, the stepped surface of the holder member isprovided with retaining recesses, into which the resin portion of theresin molded body flows. Thus, since the resin portion of the resinmolded body flows into the retaining recesses of the holder member, itis possible to retain the holder member on the resin-molded body.

Further, a fifteenth invention is a method for manufacturing arotational angle sensor including a magnetic detector for detecting arotational angle of a rotor based on a magnetic field generated betweena pair of magnets respectively disposed across the rotational axis ofthe rotor, each main terminal connected with each connection terminal ofthe magnetic detector, and a holder member for housing the magneticdetector and magnetic-detector-side connection portions of therespective main terminals, the method comprising the steps of: pressmolding an electrically conductive sheet stock so as to form a mainterminal unit in which the respective main terminals are connected viatie bars; connecting each connection terminal of the magnetic detectorwith the main terminal unit so as to form a main terminal assembly;disposing the magnetic detector of the main terminal assembly and themagnetic-detector-side connection portions of the respective mainterminals to be housed into the holder member; and removing the tie barsfrom the main terminal unit. According to the method of the fifteenthinvention for manufacturing the rotational angle sensor, press molding asheet stock so as to form a main terminal unit enables each mainterminal to be accurately molded. Further, connecting each connectionterminal of the magnetic detector with the main terminal unit so as toform a main terminal assembly enables each connection terminal of themagnetic detector to be accurately connected to each main terminal.Further, disposing the magnetic detector of the main terminal assemblyand the magnetic-detector-side connection portions of the respectivemain terminals to be housed into the holder member enables the magneticdetector to be easily disposed in position within the holder member insuch a way that the magnetic detector is supported on the main terminalassembly. Further, removing the tie bars from the main terminal unitenables each main terminal to be easily formed separately. Therefore,the rotational angle sensor of the first invention can be reasonablymanufactured.

Further, a sixteenth invention is the method of the fifteenth inventionfor manufacturing the rotational angle sensor, in which the connectionsbetween the main terminal unit and the respective connection terminalsof the magnetic detector are disposed in a row, while a welding head forwelding each connection terminal of the magnetic detector and therespective main terminals at the connections is sequentially moved inthe row direction as performing the welding. According to the sixteenthinvention constructed as above, the connections between the mainterminal unit and the respective connection terminals of the magneticdetector are disposed in a row, while the welding head can besequentially moved in the row direction as each connection terminal ofthe magnetic detector is welded with each main terminal. Therefore,since the movement of the welding head of the welding facility can besimplified, it is possible to use a simple welding facility so as tolower the cost.

Further, a seventeenth invention is a throttle control device fordriving a throttle valve, which rotatably opens and closes an intake airpassageway provided in a throttle body by a motor, so as to controlintake air flow flowing through the intake air passageway, in which thethrottle control device includes any one of the rotational angle sensorsof the first to the fourteenth inventions so as to be constructed todetect opening degrees of the throttle valve. According to the throttlecontrol device of the seventeenth invention constructed as above, thethrottle control device is constructed to include any one of therotational angle sensors of the first to the fourteenth inventions so asto detect opening degrees of the throttle valve. Therefore, it ispossible to provide a throttle control device including a rotationalangle sensor that can lower the cost.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional plan view of a throttle control device,showing a first embodiment of the present invention;

FIG. 2 is a rear view showing a cover;

FIG. 3 is a cross-sectional view taken along line A-A in FIG. 2;

FIG. 4 is a bottom view showing a cover;

FIG. 5 is a front view showing the cover in partially broken awaymanner;

FIG. 6 is a side view showing a sensor IC;

FIG. 7 is a front view showing the sensor IC;

FIG. 8 is a side view showing a first sensor IC;

FIG. 9 is a side view showing a second sensor IC;

FIG. 10 is a perspective view showing a main terminal unit;

FIG. 11 is a right side view showing the main terminal unit;

FIG. 12 is a rear view showing the main terminal unit;

FIG. 13 is a right side view showing a main terminal assembly;

FIG. 14 is a rear view showing the main terminal assembly;

FIG. 15 is a front view showing a holder member;

FIG. 16 is a cross-sectional view taken along line B-B in FIG. 15;

FIG. 17 is a rear view showing the holder member;

FIG. 18 is a front view showing a sensor assembly;

FIG. 19 is a cross-sectional view taken along line C-C in FIG. 18;

FIG. 20 is a rear view showing the sensor assembly;

FIG. 21 is an exploded perspective view showing components of the sensorassembly;

FIG. 22 is a front view showing the sensor assembly in which tie barshave been cut;

FIG. 23 is a cross-sectional view taken along line D-D in FIG. 22;

FIG. 24 is a rear view showing the sensor assembly in which tie barshave been cut;

FIG. 25 is a front view showing a sensor terminal;

FIG. 26 is a front view showing a sensor terminal assembly;

FIG. 27 is a front view showing the sensor terminal assembly in whichtie bars have been cut;

FIG. 28 is a front view showing a first plate terminal;

FIG. 29 is a right side view showing the first plate terminal;

FIG. 30 is a front view showing a second plate terminal;

FIG. 31 is a right side view showing the second plate terminal;

FIG. 32 is a front view showing a sensor assembly according to a secondembodiment of the present invention;

FIG. 33 is a cross-sectional view taken along line E-E in FIG. 32;

FIG. 34 is a rear view showing the sensor assembly;

FIG. 35 is a cross-sectional plan view showing a throttle control deviceaccording to a third embodiment of the present invention;

FIG. 36 is a front view showing a cover;

FIG. 37 is a top view showing the cover;

FIG. 38 is a rear view showing the cover;

FIG. 39 is a cross-sectional view taken along line F-F in FIG. 36;

FIG. 40 is a front view showing a sensor IC;

FIG. 41 is a side view showing the sensor IC;

FIG. 42 is a rear view showing the sensor IC;

FIG. 43 is a side view showing a first sensor IC;

FIG. 44 is a rear view showing the first sensor IC;

FIG. 45 is a front view showing a second sensor IC;

FIG. 46 is a side view showing the second sensor IC;

FIG. 47 is a perspective view showing a main terminal unit;

FIG. 48 is a development view showing the main terminal unit;

FIG. 49 is a front view showing the main terminal unit;

FIG. 50 is a right side view showing the main terminal unit;

FIG. 51 is a cross-sectional view taken along line G-G in FIG. 49;

FIG. 52 is a front view showing a capacitor;

FIG. 53 is a front view showing a first capacitor;

FIG. 54 is a right side view showing the first capacitor;

FIG. 55 is a front view showing a second capacitor;

FIG. 56 is a right side view showing the second capacitor;

FIG. 57 is a front view showing a main terminal assembly;

FIG. 58 is a cross-sectional view taken along line H-H in FIG. 57;

FIG. 59 is a cross-sectional view taken along line I-I in FIG. 57;

FIG. 60 is a cross-sectional view taken along line J-J in FIG. 57;

FIG. 61 is a front view showing a relationship between a welding headand a jig against the main terminal assembly;

FIG. 62 is a cross-sectional view taken along line K-K in FIG. 61;

FIG. 63 is a perspective view showing the welding head;

FIG. 64 is a plan view showing the jig;

FIG. 65 is a front view showing a holder member;

FIG. 66 is a cross-sectional view taken along line M-M in FIG. 65;

FIG. 67 is a rear view showing the holder member;

FIG. 68 is an exploded perspective view showing components of the sensorassembly;

FIG. 69 is a front view showing the sensor assembly;

FIG. 70 is a cross-sectional view taken along line N-N in FIG. 69;

FIG. 71 is a front view showing the sensor assembly in which a pottingmaterial has been potted into the holder member;

FIG. 72 is cross-sectional view taken along line P-P in FIG. 71;

FIG. 73 is a front view showing the sensor assembly in which tie barshave been cut;

FIG. 74 is a cross-sectional view taken along line Q-Q in FIG. 73;

FIG. 75 is a front view showing a sensor terminal;

FIG. 76 is a right side view showing the sensor terminal;

FIG. 77 is a front view showing a sensor terminal assembly;

FIG. 78 is a front view showing the sensor terminal assembly in whichtie bars have been cut;

FIG. 79 is a front view showing a first plate terminal;

FIG. 80 is a right side view showing the first plate terminal;

FIG. 81 is a front view showing a second plate terminal;

FIG. 82 is a right side view showing the second plate terminal; and

FIG. 83 is a cross-sectional side view showing a molding die for acover.

DETAILED DESCRIPTION OF THE INVENTION

Referring now to embodiments, a best mode for carrying out the presentinvention will be described.

First Embodiment

A first embodiment of the invention will be described. It should benoted that this embodiment illustrates a rotational angle sensor used asa throttle sensor for detecting a rotational angle of a throttle valveof an electronically-control-type throttle control device, moreparticularly a rotational angle of a throttle shaft to which thethrottle valve is attached.

The electronically-control-type throttle control device will firstly bedescribed. As shown in FIG. 1, this throttle control device TC includesa throttle body 1 made of resin such as PBT. The throttle body 1includes a bore wall portion 2 and a motor housing portion 3 that areintegrated with each other. The bore wall portion 2 forms asubstantially cylindrical intake air passageway 4, which passesorthogonal to the plane of the drawing as viewed in FIG. 1. Although notshown in the drawings, an air cleaner is connected to an upstream sideof the bore wall portion 2 of the throttle body 1, while an intakemanifold is connected to a downstream side of the bore wall portion 2.

A metal throttle shaft 6, which extends across the intake air passageway4 in the diametrical direction, is disposed in the bore wall portion 2.A left-side support portion 7, which is integrally formed in the borewall portion 2, rotatably supports one end 6 a (the left end portion asviewed in FIG. 1) of the throttle shaft 6 via a bearing 8. Further, asupport portion 9, which is integrally formed in the bore wall portion 2on the right side, rotatably supports the other end (the right endportion as viewed in FIG. 1) of the throttle shaft 6 via a bearing 10.Further, a throttle valve 12, which can rotatably open and close theintake air passageway 4, is secured to the throttle shaft 6, forexample, via rivets 13. The throttle valve 12 controls an intake airflow flowing through the intake air passageway 4 by opening and closingthe intake air passageway 4 when driven by a motor 20 (later described).

The left-side support portion 7 is fitted with a plug 14 sealing theopening end thereof. Further, the right end 6 b of the throttle shaft 6passes through the support portion 9. A throttle gear 16, which isconfigured as a sector gear, for example, made of resin, is rotationallylocked to be secured to the right end 6 b of the throttle shaft 6.Further, a return spring 17 is provided between the throttle body 1 andthe throttle gear 16. The return spring 17 constantly biases thethrottle gear 16 in the closing direction of the throttle valve 12. Itshould be noted that a stopper member, not shown in the drawings, isprovided between the throttle body 1 and the throttle gear 16 so as tostop the throttle valve 12 at a predetermined closed position.

The motor housing portion 3 of the throttle body 1 is formed as asubstantially cylindrical, closed-end tube that extends parallel to therotational axis L of the throttle shaft 6 and opens at the right endsurface as viewed in FIG. 1. The motor 20 consisting of such as a DCmotor is inserted into the motor housing portion 3. The shell of themotor 20 is formed by a motor case 21, which is provided with a mountingflange 22 secured by a screw 23 to the opened end of the motor housingportion 3.

An output shaft 24, which projects to the right side of the motor 20 asviewed in FIG. 1, is provided with a motor pinion 26, for example, madeof resin. Further, the throttle body 1 is provided with a counter shaft27 that extends parallel to the rotational axis L of the throttle shaft6. The counter shaft 27 rotatably supports a counter gear 28, forexample, made of resin. The counter gear 27 includes gears withdifferent diameters, a larger one of which is a gear portion 28 a and asmaller one a gear portion 28 b. The larger-diameter gear portion 28 aengages the motor pinion 26, while the smaller-diameter gear portion 28b engages the throttle gear 16. It should be noted that the throttlegear 16, the motor pinion 26 and the counter gear 28 form aspeed-reduction gear mechanism 29.

One lateral surface (the right-side surface as viewed in FIG. 1) of thethrottle body 1 is coupled with a cover 30, for example, made of resinsuch as PBT. The cover 30 covers the speed-reduction gear mechanism 29and the like. Further, an O-ring 31 is interposed between the throttlebody 1 and the cover 30 so as to maintain a hermetic seal of the inside.Further, pin portions 32 project from the mating surface of the cover 30against the throttle body 1. Further, the mating surface of the throttlebody 1 against the cover 30 is provided with receiving portions 33, intowhich the pin portions 32 are engageable. When the pin portions 32engage into the receiving portions 33, the throttle body 1 and the cover30 are positioned in place. It should be noted that the cover 30 isequivalent to the “resin molded body” herein.

The motor 20 includes two motor terminals 35 (only one of which is shownin FIG. 1), which are respectively connected with relay connectors 36provided in the cover 30 (see FIG. 2). One (the upper side as viewed inFIG. 2) of the relay connectors 36 is connected with a connectorconnection end 37 a of a first plate terminal 37, which is insert moldedor inserted to be resin molded into the cover 30. Further, the other(the lower side as viewed in FIG. 2) of the relay connectors 36 isconnected with a connector connection end 38 a of a second plateterminal 38, which is insert molded or inserted to be resin molded intothe cover 30. It should be noted that FIG. 28 is a front view showingthe first plate terminal 37, while FIG. 29 is a right side view showingthe same. Further, FIG. 30 is a front view showing the second plateterminal 38, while FIG. 31 is a right side view showing the same.Further, the outer surface of each plate terminal 37, 38 is plated withNi (not shown).

Further, as shown in FIG. 2, an external connection end 37 b, 38 b ofeach plate terminal 37, 38 projects into a substantially horizontallyrectangular cylinder shaped connector portion 40, which is formed in apredetermined portion (the lower portion as viewed in FIG. 2) of thecover 30. Further, the connector portion 40 of the cover 30 isconnectable with an unshown external connector. Further, the externalconnection end 37 b, 38 b of the plate terminals 37, 38, and externalconnection ends 111 b, 112 b, 113 b, 114 b of the sensor terminals 111,112, 113, 114 that will be later described, are connectable both withthe external connector (not shown) for the connector portion 40 and witheach terminal pin (not shown) within the external connector.

Referring to FIG. 1, the drive of the motor 20 is controlled by acontrol means such as an engine control unit, or the so-called ECU, ofthe automobile, in response to accelerator signals representing theamount of depression of an accelerator pedal, traction control signals,constant-speed signals and idling speed control signals. Further,driving forces of the output shaft 24 of the motor 20 are transferredfrom the motor pinion 26 to the throttle shaft 6 via the counter gear 28and the throttle gear 16 so as to open and close the throttle valve 12.

The throttle gear 16 is provided with a substantially cylindricaltubular portion 16 a. The tubular portion 16 a is concentric with thethrottle shaft 6. The inner peripheral surface of the tubular portion 16a is provided with a yoke 43 made of a ring-shaped magnetic material,which is insert molded or inserted to be resin molded in the tubularportion 16 a, so as to be concentric with the throttle shaft 6. Itshould be noted that the throttle gear 16 is equivalent to the “rotor”herein.

The inner surface of the throttle gear 16 is provided with a pair ofmagnets 44, 45 generating magnetic fields. The magnets 44, 45 aredisposed in line symmetry with the rotational axis L of the throttleshaft 6 such that the magnets 44, 45 and the yoke 43 are insert moldedor inserted to be resin molded in the throttle gear 16. The pair ofmagnets 44, 45, which consist of such as ferrite magnets, are formed inarc shape along with the inner surface of the yoke 43 (see two-dot chainlines 44, 45 in FIG. 22). Further, the pair of magnets 44, 45 areparallel magnetized such that the magnetic lines, or magnetic fields,generated between both are formed in a parallel relationship, andthereby substantially parallel magnetic fields are generated in thespace defined within the yoke 43. It should be noted that the ferritemagnets forming the pair of magnets 44, 45 could be easily formed in arcshape because the ferrite magnets are softer and higher in toughnessthan rare-earth magnets, and also inexpensive because the material costsless.

Then, as shown in FIG. 2, the relay connectors 36 and the plateterminals 37, 38, as well as a sensor terminal assembly 120 (laterdescribed, see FIG. 27), are insert molded or inserted to be resinmolded into the cover 30. Further, as shown in FIG. 26, the sensorterminal assembly 120 consists of the sensor assembly 100 and the sensorterminal unit 110. The sensor terminal assembly 120 is formed when eachtie bar 115 a, 115 b, 115 c, 116 a, 116 b, 116 c (later described) isremoved from the sensor terminal unit 110 (see FIG. 27). Further, asshown in FIGS. 18 to 20, the sensor assembly 100 consists of the mainterminal assembly 70 and the holder member 90. The sensor assembly 100is formed when each tie bar 65, 66, 67, 68, (later described) is removedfrom the main terminal assembly 70 (see FIGS. 22 to 24).

For convenience of description, the main terminal assembly 70, theholder member 90, the sensor assembly 100, the sensor terminal unit 110,the sensor terminal assembly 120 and the cover 30 will be describedbelow in this order. It should be noted that the components of thesensor assembly 100 are shown in FIG. 21 in an exploded perspectiveview. Further, in this embodiment, the main terminal assembly 70, theholder member 90, the sensor assembly 100, the sensor terminal unit 110and the sensor terminal assembly 120 are described in such a way thatthe reverse side (the left side as viewed in FIG. 1) of the cover 30 isregarded as the forward side (the front side), while the front side (theright side as viewed in FIG. 1) of the cover 30 is regarded as the backside (rear side).

Firstly, the main terminal assembly 70 will be described. It should benoted that FIG. 13 is a side view showing the main terminal assembly 70;and FIG. 14 is a rear view showing the same. As shown in FIGS. 13 and14, the main terminal assembly 70 consists of two sensor ICs 50(1),50(2), one main terminal unit 60 and four capacitors 81, 82, 83, 84 (seeFIG. 21). Two of the same sensor ICs 50 are used as the two sensor ICs50(1), 50(2). As shown in FIGS. 6 and 7, the sensor IC 50 includes amagnetic sensing portion 51 and a computing portion, which is arrangedin the rear (the right side as viewed in FIGS. 6 and 7) of the magneticsensing portion 51. The magnetic sensing portion 51 is configured in asubstantially square plate shape, while the computing portion isconfigured in a substantially rectangular plate shape. The magneticsensing portion 51 and the computing portion 52 are electricallyconnected with each other by, for example, six connecting terminals 53(see FIG. 7). The magnetic sensing portion 51 includes magnetoresistiveelements embedded in a shell, for example, made of resin. Further, boththe left and the right sides of the shell of the magnetic sensingportion 51 are provided with metal positioning pieces 54, which projectsymmetrically from both the left and right sides (symmetrically aboutthe left-right axis as viewed in FIG. 7). When the sensor ICs 50 areinjection molded, these positioning pieces 54 are retained in the die aspositioning pieces of the magnetoresistive elements. Further, thecomputing portion 52 includes an input connection terminal. 55, a groundconnection terminal 56 and an output connection terminal 57 projectingparallel to each other and rearward (rightward as viewed in FIG. 7). Itshould be noted that, the sensor IC 50 is equivalent to the “magneticdetector” herein.

As shown in FIG. 8, one of the two sensor ICs 50 is formed as a firstsensor IC 50(1), the connecting terminals 53 of which are folded suchthat the magnetic sensing portion 51 is inclined toward the reverse side(upward as viewed in FIG. 8) at an angle of approximately 90 degrees.Each connection terminal 55, 56, 57 of the first sensor IC 50(1) isfolded toward the front side (downward as viewed in FIG. 8) at an angleof approximately 90 degrees (see FIG. 21). Further, as shown in FIG. 9,the other sensor IC 50 is formed as a second sensor IC 50(2), theconnecting terminals 53 of which are folded such that the magneticsensing portion 51 is inclined toward the front side (downward as viewedin FIG. 9) at an angle of approximately 90 degrees. Each connectionterminal 55, 56, 57 of the second sensor IC 50(2) is folded toward thereverse side (upward as viewed in FIG. 9) at an angle of approximately90 degrees (see FIG. 21).

Next, the main terminal unit 60 will be described. It should be notedthat FIG. 10 is a perspective view showing the main terminal unit 60;FIG. 11 is a side view showing the same; and FIG. 12 is a rear viewshowing the same. The main terminal unit 60 is formed by press moldingan electrically conductive sheet stock such as a copper alloy plate. Asshown in FIG. 12, the main terminal unit 60 includes a signal input(referred to as Vc hereafter) main terminal 61, a signal output(referred to as V1 hereafter) main terminal 62, a signal output(referred to as V2 hereafter) main terminal 63, and a ground (referredto as GND hereafter) main terminal 64. Terminal connections 61 a, 62 a,63 a, 64 a (later described) of the main terminals 61, 62, 63, 64 areconnected with each other by tie bars 65, 66, 67, 68, which form asubstantially square frame-like shape.

More specifically, referring to FIG. 12, the Vc main terminal 61includes the terminal connection 61 a disposed in the middle portion onthe right side of the main terminal unit 60. Further, the V1 mainterminal 62 includes the terminal connection 62 a disposed in the lowerportion on the left side. Further, the V2 main terminal 63 includes theterminal connection 63 a disposed in the upper portion on the left side.Further, the GND main terminal 64 includes the terminal connection 64 adisposed in the middle portion on the left side. Then, the upper tie bar65 is configured in a substantially inverted-U-shape so as to connectthe terminal connection 61 a disposed in the middle portion on the rightside with the terminal connection 63 a disposed in the upper portion onthe left side. Further, the lower tie bar 65 is configured in asubstantially U-shape so as to connect the terminal connection 61 adisposed in the middle portion on the right side with the terminalconnection 62 a disposed in the lower portion on the left side. Further,the upper left tie bar 67 is configured in a straight line so as toconnect the terminal connection 63 a disposed in the upper portion onthe left side with the terminal connection 64 a disposed in the middleportion on the left side. Further, the lower left tie bar 68 isconfigured in a straight line extending downwardly and serially from theupper left tie bar 67, so as to connect the terminal connection 62 adisposed in the lower portion on the left side with the terminalconnection 64 a disposed in the middle portion on the left side.

Referring to FIG. 12, the Vc main terminal 61 includes the terminalconnection 61 a, as well as a capacitor connection 61 b, an upper ICterminal connection 61 c and a lower IC terminal connection 61 d. Thecapacitor connection 61 b is provided at the left end of the terminalconnection 61 a. Further, the upper IC terminal connection 61 c extendsupward from the capacitor connection 61 b. Further, the lower ICterminal connection 61 d extends downward from the capacitor connection61 b.

Further, the V1 main terminal 62 includes the terminal connection 62 a,as well as a capacitor connection 62 b and an IC terminal connection 62c. The capacitor connection 62 b is provided at the right end of theterminal connection 62 a. Further, the IC terminal connection 62 cextends upward from the capacitor connection 62 b.

Further, the V2 main terminal 63, which includes the terminal connection63 a, as well as a capacitor connection 63 b and an IC terminalconnection 63 c, is formed symmetrically about the V1 main terminal 62as the left-right axis. Thus, the capacitor connection 63 b is providedat the right end of the terminal connection 63 a. Further, the ICterminal connection 63 c extends downward from the capacitor connection63 b.

Further, the GND main terminal 64 includes the terminal connection 64 a,as well as a middle capacitor connection 64 b, an upper IC terminalconnection 64 c, an upper capacitor connection 64 d, a lower IC terminalconnection 64 e and a lower capacitor connection 61 f. The middlecapacitor connection 64 b is provided at the right end of the terminalconnection 64 a. Further, the upper IC terminal connection 64 c extendsupward from the capacitor connection 64 b so as to be parallel to andbetween the upper IC terminal connection 61 c of the Vc main terminal 61and the IC terminal connection 63 c of the V2 main terminal 63. Further,the upper capacitor connection 64 d is provided at the upper end of theupper IC terminal connection 64 c. Further, the lower IC terminalconnection 64 e extends downward from the middle capacitor connection 64b so as to be parallel to and between the upper IC terminal connection61 c of the Vc main terminal 61 and the IC terminal connection 63 c ofthe V2 main terminal 63. Further, the lower capacitor connection 64 f isprovided at the lower end of the lower IC terminal connection 64 e.

Thus, the respective capacitor connections 61 b, 62 b, 63 b, 64 d, 64 f(see FIG. 12) are provided on the same plane F1 (see FIG. 11). Further,each IC terminal connection 61 d, 62 c, 64 e (see FIG. 12) on the lowerside is provided on the same plane F2, which is displaced slightlyrearward from plane F1 (rightward as viewed in FIG. 11). Further, eachIC terminal connection 61 c, 63 c, 64 c (see FIG. 12) on the upper sideis provided on the same plane F3, which is displaced further rearwardfrom plane F2 (rightward as viewed in FIG. 11). Further, the externalends of the terminal connections 61 a, 62 a, 63 a, 64 a (see FIG. 12)and each tie bar 65, 66, 67, 68 are provided on the same plane F4, whichis displaced further rearward from plane F3 (rightward as viewed in FIG.11).

Further, as shown in FIG. 10, the middle portion of the top of the uppertie bar 65 is provided with a stepped portion 65 a, which is disposedupward from each IC terminal connection 61 c, 63 c, 64 c on the upperside. Further, the middle portion of the bottom of the lower tie bar 66is provided with a stepped portion 66 a, which is disposed downward fromeach IC terminal connection 61 d, 62 c, 64 e on the lower side. Further,both of the stepped portions 65 a, 66 a are provided on the same planeF1 (see FIG. 11), on which the respective capacitor connections 61 b, 62b, 63 b, 64 b, 64 d, 64 f are provided.

As described above, since each portion is provided on predeterminedplanes F1, F2, F3, F4, the interconnection between these portions isprovided with a folded portion, which extends from the front to thereverse. Thus, referring to FIG. 11, the terminal connection 62 a andthe capacitor connection 62 b of the V1 main terminal 62 are formed in astepped shape via a folded portion 69 a. Further, the terminalconnection 63 a and the capacitor connection 63 b of the V2 mainterminal 63 are formed in a stepped shape via a folded portion 69 b.Further, the terminal connection 64 a and the capacitor connection 64 bof the GND main terminal 64 are formed in a stepped shape via a foldedportion 69 c. Further, the terminal connection 61 a and the capacitorconnection 61 b of the Vc main terminal 61 are formed in a stepped shapevia a folded portion 69 f (see FIG. 10). Further, the upper tie bar 65is provided with a stepped portion 65 a via both folded portions 69 d onthe left and the right sides. Further, the lower tie bar 66 is providedwith a stepped portion 66 a via both folded portions 69 e on the leftand the right sides. It should be noted that the outer surface of themain terminal unit 60 is plated with Ni (not shown).

It should be noted that each IC terminal connection 61 c, 61 d, 62 c, 63c, 64 c, 64 e of the main terminals 61, 62, 63, 64 is equivalent to the“magnetic-detector-side connection portion” herein. Further, eachcapacitor connection 61 b, 62 b, 63 b, 64 b, 64 d, 64 f, and each ICterminal connection 61 c, 61 d, 62 c, 63 c, 64 c, 64 e are equivalent tothe “housed portions” herein. Further, the external end of each terminalconnection 61 a, 62 a, 63 a, 64 a is equivalent to the “exposed portion”herein. Then, the housed portion and the exposed portion are formed in astepped shape via each folded portion 69 a, 69 b, 69 c, 69 f.

Next, the main terminal assembly 70 will be described. As shown in FIGS.13 and 14, the main terminal assembly 70 is configured such that themain terminal unit 60 is implemented with the respective sensor ICs50(1), 50(2) and the capacitors 81, 82, 83, 84 (see FIG. 21). Thus, thefirst sensor IC 50(1) and the second sensor IC 50(2) are oppositelydisposed on the front (forward) of the main terminal unit 60, such thatthe magnetic sensing portion 51 of the second sensor IC 50(2) isoverlapped against the reverse side (the right side as viewed in FIG.13) of the magnetic sensing portion 51 of the first sensor IC 50(1).Under these conditions, the input connection terminal 55 of the firstsensor IC 50(1) is electrically connected with the lower IC terminalconnection 61 d of the Vc main terminal 61 of the main terminal unit 60by welding (the welded portion is designated as 71 in FIG. 14). Further,the ground connection terminal 56 of the first sensor IC 50(1) iselectrically connected with the lower IC terminal connection 64 e of theGND main terminal 64 of the main terminal unit 60 by welding (the weldedportion is designated as 72 in FIG. 14). Further, the output connectionterminal 57 of the first sensor IC 50(1) is electrically connected withthe IC terminal connection 62 c of the V1 main terminal 62 of the mainterminal unit 60 by welding (the welded portion is designated as 73 inFIG. 14).

Further, the input connection terminal 55 of the second sensor IC 50(2)is electrically connected with the upper IC terminal connection 61 c ofthe Vc main terminal 61 of the main terminal unit 60 by welding (thewelded portion is designated as 74 in FIG. 14). Further, the groundconnection terminal 56 of the second sensor IC 50(2) is electricallyconnected with the upper IC terminal connection 64 c of the GND mainterminal 64 of the main terminal unit 60 by welding (the welded portionis designated as 75 in FIG. 14). Further, the output connection terminal57 of the second sensor IC 50(2) is electrically connected with the ICterminal connection 63 c of the V2 main terminal 63 of the main terminalunit 60 by welding (the welded portion is designated as 76 in FIG. 14).It should be noted that the respective welded portions 71 to 76 might bewelded, for example, by projection welding.

Further, as shown in FIG. 14, the first capacitor 81 and the secondcapacitor 82 are connected electrically and parallel in the left-rightdirection by soldering between the capacitor connection 61 b of the Vcmain terminal 61 and the middle capacitor connection 64 b of the GNDmain terminal 64 on the reverse of the main terminal unit 60. Further, athird capacitor 83 is electrically connected by soldering between thecapacitor connection 62 b of the V1 main terminal 62 and the lowercapacitor connection 64 f of the GND main terminal 64. Further, a fourthcapacitor 84 is electrically connected by soldering between thecapacitor connection 63 b of the V2 main terminal 63 and the uppercapacitor connection 64 d of the GND main terminal 64. It should benoted that each capacitor 81, 82, 83, 84 serves as a preventive measurefor discharge of positive charges such that high voltages due to staticelectricity may not be applied to the respective sensor ICs 50(1),50(2). Further, chip-type capacitors or so-called chip capacitors areused for the capacitors 81, 82, 83, 84 of this embodiment.

Next, the holder member 90 will be described. It should be noted thatFIG. 15 is a front view showing the holder member 90; FIG. 16 is across-sectional view taken along line B-B in FIG. 15; and FIG. 17 is arear view showing the holder member 90. The holder member 90, which is,for example, made of resin, is configured to mainly have a closed-endrectangular cylinder shaped hollow tube portion 91 that closes the frontside and opens the rear side (see FIG. 16). The rear side (the rightside in FIG. 16) of the hollow tube portion 91 is provided continuouslywith an enlarged tube portion 93 such that the opening is enlarged viaan intermediate end plate portion 92.

Guiding grooves 94 are provided in the middle portion of the opposedwall surfaces of both the left and the right sidewalls 91 a, 91 b (seeFIG. 17) of the hollow tube portion 91 in such a manner that the grooves94 extend in the front-rear direction (the left-right direction in FIG.16). It should be noted that the guiding grooves 94 are equivalent tothe “guiding portions” herein. More specifically, referring to FIG. 16,the bottom ends of the guiding grooves 94 (the ends on the bottom endsurface 91 e side of the hollow tube portion 91) are formed aspositioning grooves 94 a, the widths (the widths extending in theup-down direction in FIG. 16) of which are configured to receive thepositioning pieces 54 (see FIG. 7) projecting from both the left and theright sides of the magnetic sensing portions 51 (see FIG. 13) of thesensor ICs 50(1), 50(2). Further, the portions extending from thepositioning grooves 94 a of the guiding grooves 94 to the opening endsurface of the hollow tube portion 91 are formed as tapered grooves 94b, the widths (the widths extending in the up-down direction in FIG. 16)of which are configured in a tapered shape so as to be graduallyenlarged from the positioning grooves 94 a to the opening end surface ofthe hollow tube portion 91. Further, the spacing defined between boththe left and the right sidewalls 91 a, 91 b of the hollow tube portion91 (see FIG. 17) is configured to be slightly wider than the width (thewidth extending in the up-down direction in FIG. 7) of the magneticsensing portion 51 and the computing portion 52 of the respective sensorICs 50(1), 50(2).

Next, the sensor assembly 100 will be described. It should be noted thatFIG. 18 is a front view of the sensor assembly 100; FIG. 19 is across-sectional view taken along line C-C in FIG. 18; and FIG. 20 is arear view of the sensor assembly 100. The sensor assembly 100 includesthe main terminal assembly 100 and the holder member 90 (see FIG. 21).As shown in FIGS. 18 to 20, each sensor IC 50(1), 50(2) of the mainterminal assembly 70 is inserted into and housed in the hollow tubeportion 91 of the holder member 90. At this point, each positioningpiece 54 of the magnetic sensing portion 51 of the first sensor IC 50(1)is fitted into the tapered groove 94 b of each guiding groove 94 on theleft or the right of the holder member 90, guided toward a predeterminedassembled position, and finally engaged into the positioning groove 94 a(see FIG. 16) so as to be positioned in the predetermined assembledposition. Accordingly, the magnetic sensing portion 51 of the firstsensor IC 50(1) abuts on the bottom end surface 91 e of the hollow tubeportion 91 of the holder member 90 in surface-to-surface contactingmanner, while the computing portion 52 abuts on the lower wall surface91 d of the hollow tube portion 91 of the holder member 90 insurface-to-surface contacting manner.

Subsequently, each positioning piece 54 of the magnetic sensing portion51 of the second sensor IC 50(2) is fitted into the tapered groove 94 bof each guiding groove 94 on the left or the right of the holder member90, guided toward a predetermined assembled position, and finallyengaged into the positioning groove 94 a (see FIG. 16) so as to bepositioned in the predetermined assembled position. Accordingly, thecomputing portion 52 of the second sensor IC 50(2) abuts on the upperwall surface 91 c of the hollow tube portion 91 of the holder member 90in surface-to-surface contacting manner. As described above, the centerof the magnetic sensing portion 51 of each sensor IC 50(1), 50(2) isaligned with an axis of the hollow tube portion 91 of the holder member90 (see FIG. 19).

When each sensor IC 50(1), 50(2) is housed into the hollow tube portion91 of the holder member 90 as described above, the connection portionbetween each connection terminal 55, 56, 57 of each sensor IC 50(1),50(2) with each main terminal 61, 62, 63, 64, and each capacitor 81, 82,83, 84 etc. are housed into the enlarged tube portion 93 of the holdermember 90. Accordingly, the capacitor connection 61 b, 62 b, 63 b, 64 b,64 d, 64 f (see FIG. 12) of each main terminal 61, 62, 63, 64 abuts theintermediate end plate portion 92 of the holder member 90. Further, theexternal end of each terminal connection 61 a, 62 a, 63 a, 64 a and eachtie bar 65, 66, 67, 68 remain exposed from the enlarged tube portion 93of the holder member 90. Thus, when the external end of each terminalconnection 61 a, 62 a, 63 a, 64 a, i.e., the exposed portion of eachmain terminal 61, 62, 63, 64, is disposed outside of the opening of theholder member 90, each capacitor connection 61 b, 62 b, 63 b, 64 b, 64d, 64 f and each IC terminal connection 61 c, 61 d, 62 c, 63 c, 64 c, 64e, i.e., the housed portions, are housed into the holder member 90 witheach sensor IC 50(1), 50(2) and each capacitor 81, 82, 83, 84, so as tobe closer to the bottom than the exposed portion within the holdermember 90.

Under these conditions, a potting material 102 is substantially entirelywithin the holder member 90, for example, by a dispenser (not shown).Accordingly, each sensor IC 50(1), 50(2), each connection terminal 55,56, 57 thereof, each capacitor 81, 82, 83, 84, and the housed portion ofeach main terminal 61, 62, 63, 64 housed within the holder member 90 areburied with a potting material 102 (see two-dot chain lines 102 in FIG.19).

Further, a resin such as an epoxy resin, which is permanently soft butwhich does not inadvertently drip, is adopted as the potting material102 such that each sensor IC 50(1), 50(2) and each capacitor 81, 82, 83,84 are protected from thermal stress, vibration and the like. Further,potting the potting material 102 into the hollow tube portion 91 of theholder member 90 avoids the occurrence of distortions of the magneticsensing portion 51 of each sensor IC 50(1), 50(2) such that declining ofthe detection accuracy due to the occurrence of distortions can beprevented. Although insert molding, for example, may lead to a problemof declining of the detection accuracy because the magnetic sensingportion 51 of each sensor IC 50(1), 50(2) is distorted by insertingpressure of the resin, it is possible to eliminate such a problem bypotting the potting material 102.

After potting the potting material 102, each tie bar 65, 66, 67, 68 ofthe main terminal unit 60 is removed by cutting. Accordingly, eachseparated main terminal 61, 62, 63, 64 is formed from the main terminalunit 60. The sensor assembly 100 configured as above serves as a basisof a rotational angle sensor (designated as Se). It should be noted thatFIG. 22 is a front view showing the sensor assembly 100 in which the tiebars of the main terminal unit have been cut; FIG. 23 is across-sectional view taken along line D-D in FIG. 22; and FIG. 24 is arear view of the same sensor assembly 100.

The sensor terminal unit 110 will now be described. FIG. 25 is a frontview of the sensor terminal unit 110. The sensor terminal unit 110 isformed by press molding an electrically conductive sheet stock such as acopper alloy plate. The sensor terminal unit 110 includes the Vc sensorterminal 111, the V1 sensor terminal 112, the V2 sensor terminal 113,and the GND sensor terminal 114. Then, the adjacent sensor terminals111, 112, 113, 114 are connected with each other by each tie bar 115 a,115 b, 115 c, 116 a, 116 b, 116 c. More specifically, referring to FIG.25, in the lower portion of the terminal connection side or the rightside of the sensor terminal unit 110, the Vc sensor terminal 111 isarranged parallel to the V1 sensor terminal 112 substantially downwardof the sensor terminal 111. Further, in the upper portion of the rightside, the GND sensor terminal 114 is arranged parallel to the V2 sensorterminal 113 substantially downward of the sensor terminal 114. The tiebars 115 a, 115 b, 115 c are arranged serially in a straight lineextending in the up-down direction. The upper tie bar 115 a connects theGND sensor terminal 114 with the V2 sensor terminal 113. Further, themiddle tie bar 115 b connects the V2 sensor terminal 113 with the Vcsensor terminal 111. Further, the lower tie bar 115 c connects the V2sensor terminal 113 with the V1 sensor terminal 112.

Further, in the lower portion of the left side or the externalconnection side of the sensor terminal unit 110, the GND sensor terminal114, the V2 sensor terminal 113, the Vc sensor terminal 111, and the V1sensor terminal 112 are arranged parallel in the left-right direction.The tie bars 115 a, 115 b, 115 c are arranged serially in a straightline extending in the left-right direction. The left-side tie bar 116 aconnects the GND sensor terminal 114 with the V2 sensor terminal 113.Further, the middle tie bar 116 b connects the V2 sensor terminal 113with the Vc sensor terminal 111. Further, the right-side tie bar 116 cconnects the Vc sensor terminal 111 with the V1 sensor terminal 112.

Referring to FIG. 25, the Vc sensor terminal 111 includes the terminalconnection end 111 a provided at one end thereof or the right end of theterminal connection side, and the external connection end 111 b providedat the other end thereof or the left end of the external connectionside. The terminal connection end 111 a is formed to be connectable withthe terminal connection 61 a (see FIG. 22) of the Vc main terminal 61 ofthe sensor assembly 100. Further, the external connection end 111 b isformed to be connectable with the corresponding terminal pin (not shown)of the unshown external connector. Further, the V1 sensor terminal 112includes the terminal connection end 112 a provided at one end thereofor the right end of the terminal connection side, and the externalconnection end 112 b provided at the other end thereof or the left endof the external connection side. The terminal connection end 112 aextends in surrounding manner to the lower portion of the holder member90 in the sensor assembly 100 so as to be connectable with the terminalconnection 62 a (see FIG. 22) of the V1 main terminal 62 in the sensorassembly 100. Further, the external connection end 112 b is formed to beconnectable with the corresponding terminal pin (not shown) of theunshown external connector. Further, the V2 sensor terminal 113 includesthe terminal connection end 113 a provided at one end thereof or theright end of the terminal connection side, and the external connectionend 113 b provided at the other end thereof or the left end of theexternal connection side. The terminal connection end 113 a extends insurrounding manner to the upper portion of the holder member 90 in thesensor assembly 100 so as to be connectable with the terminal connection63 a (see FIG. 22) of the V2 main terminal 62 in the sensor assembly100. Further, the external connection end 113 b is formed to beconnectable with the corresponding terminal pin (not shown) of anunshown external connector. Further, the GND sensor terminal 114includes the terminal connection end 114 a provided at one end thereofor the right end of the terminal connection side, and the externalconnection end 114 b provided at the other end thereof or the left endof the external connection side. The terminal connection end 114 aextends in surrounding manner to the upper portion of the holder member90 in the sensor assembly 100 so as to be connectable with the terminalconnection 64 a (see FIG. 22) of the GND main terminal 64 in the sensorassembly 100. Further, the external connection end 114 b is formed to beconnectable with the corresponding terminal pin (not shown) of theunshown external connector.

Further, the external connection ends 111 b, 112 b, 113 b, 114 b of thesensor terminals 111, 112, 113, 114 extend downward in such a mannerthat the external connection end 112 b, the external connection end 111b, the external connection end 113 b, the external connection end 114 bare arranged parallel in this order from the right to the left. Itshould be noted that the outer surface of the sensor terminal unit 110is plated with Ni (not shown), while each terminal connection end 111 a,112 a, 113 a, 114 a, is plated with Au. Further, each sensor terminal111, 112, 113, 114 is provided with an appropriate number of throughholes 111 h, 112 h, 113 h, 114 h, respectively (see FIG. 25). When thecover 30 (later described) is resin molded, each through hole 111 h, 112h, 113 h, 114 h is fitted with a positioning pin (not shown) of amolding die such that each sensor terminal 111, 112, 113, 114 ispositioned in the die. Similarly, each plate terminal 37, 38 is providedwith an appropriate number of through holes 37 h, 38 h (see FIGS. 28 and30).

Next, the sensor terminal assembly 120 will be described. FIG. 26 is afront view of the sensor terminal assembly. The sensor terminal assembly120 is configured such that the sensor terminal unit 110 (see FIG. 25)is implemented with the sensor assembly 100 (see FIGS. 22 to 24). Thus,the terminal connection 61 a of the Vc main terminal 61 of the sensorassembly 100 is electrically connected on the terminal connection end111 a of the Vc sensor terminal 111 of the sensor terminal unit 110 bywelding (the welded portion is designated as 121). Further, the terminalconnection 62 a of the V1 main terminal 62 of the sensor assembly 100 iselectrically connected on the terminal connection end 112 a of the V1sensor terminal 112 of the sensor terminal unit 110 by welding (thewelded portion is designated as 122). Further, the terminal connection63 a of the V2 main terminal 63 of the sensor assembly 100 iselectrically connected on the terminal connection end 113 a of the V2sensor terminal 113 of the sensor terminal unit 110 by welding (thewelded portion is designated as 123). Further, the terminal connection64 a of the GND main terminal 64 of the sensor assembly 100 iselectrically connected on the terminal connection end 114 a of the GNDsensor terminal 114 of the sensor terminal unit 110 by welding (thewelded portion is designated as 124). It should be noted that therespective welded portions 121, 122, 123, 124 might be welded, forexample, by projection welding.

After the welding, each tie bar 115 a, 115 b, 115 c, 116 a, 116 b, 116 cof the sensor terminal unit 110 is removed by cutting. Accordingly, asshown in FIG. 27, separated sensor terminals 111, 112, 113, 114 areformed. The sensor terminals 111, 112, 113, 114 formed as above areequivalent to the “subterminals” and the “external terminals” herein. Itshould be noted that FIG. 27 shows a front view of the sensor terminalassembly 120 in which the tie bars have been cut.

The cover 30 will now be described. As shown in FIG. 2, the cover 30 isformed in such a way that the sensor terminal assembly 120 (see FIG.27), the plate terminals 37, 38 (see FIGS. 28 to 31), and the relayconnectors 36 are insert molded or inserted to be resin molded. Further,when the cover 30 is resin molded, the resin portion of the cover 30surrounding the holder member 90 of the sensor terminal assembly 120 isprevented from burring on a burring prevention surface 126 in the middleof the hollow tube portion 91 of the holder member 90. It should benoted that “burring prevention” is also referred to as “burring cut.”This term refers to blocking a resin flow toward the exposed portion bythe die fitting to the exposed portion such that a portion not buried bythe resin portion (the half portion on the bottom side of the hollowtube portion 91 of the holder member 90 in this embodiment (equivalentto the left half portion as viewed in FIG. 3)) when the resin molding isperformed. Then, the end surface of the resin portion, which is moldedby the die fitting to the exposed portion and surrounds the exposedportion, is referred to as a “burring prevention surface.”

Further, as shown in FIG. 2, the external connection ends 111 b, 112 b,113 b, 114 b of the sensor terminals 111, 112, 113, 114, as well as theexternal connection ends 37 b, 38 b of the plate terminals 37, 38,project into the connector portion 40 of the cover 30 (see FIG. 4).Further, the external connection ends 37 b, 38 b, 111 b, 112 b, 113 b,114 b are arranged in a row in the left-right direction in FIG. 4. Itshould be noted that the external connection ends 38 b, 37 b, 114 b, 113b, 111 b, 112 b are arranged in this order from the left to the right inFIG. 4 in this embodiment. Further, as previously described, eachexternal connection end 37 b, 38 b, 111 b, 112 b, 113 b, 114 b isconnectable with each terminal pin (not shown) within the externalconnector (not shown) connected with the connector portion 40. Asdescribed above, the sensor assembly 100 is provided with the sensorterminals 111, 112, 113, 114, the cover 30, the relay connectors 36, andthe plate terminals 37, 38 such that the rotational angle sensor Se isconfigured (see FIG. 2).

The cover 30 configured as above is connected with the lateral surface(the right-side surface as viewed in FIG. 1) of the throttle body 1 soas to complete the throttle control device TC. Accordingly, the hollowtube portion 91 of the holder member 90 of the rotational angle sensorSe is disposed substantially concentric with the axis of the yoke 43 orthe rotational axis L of the throttle shaft 6 so as to be between themagnets 44, 45 and in a predetermined spaced relationship with eachmagnet. Further, since the magnetic sensing portions 51 of the sensorICs 50(1), 50(2) of the rotational angle sensor Se are disposed betweenthe magnets 44, 45 such that the rotational axis L of the throttle shaft6 is substantially concentric with the sensing portions 51 and alsoorthogonal with the square surfaces of the magnetic sensing portions 51,the magnetic field direction generated between the pair of magnets 44,45 is accurately detected.

Thus, the sensor ICs 50(1), 50(2) (see FIG. 3) allow the computingportions 52 to calculate outputs from the magnetoresistive elementswithin the magnetic sensing portions and to output signals representingthe magnetic field direction to the control means such as ECU so as tobe configured to detect the magnetic field direction without dependingon the magnetic field intensity. Further, since two sensor ICs are used,it is possible to perform detection with a high accuracy. Also, even ifeither of them fails, the remaining one can detect the magnetic fielddirection.

In the aforementioned throttle control device TC (see FIG. 1), when theengine is started, the drive of the motor 20 is controlled by a controlmeans such as ECU. Accordingly, as previously described, an intakeairflow flowing through the intake air passageway 4 of the throttle body1 is controlled by opening and closing the throttle valve 12 via thespeed-reduction gear mechanism. Then, as the throttle shaft 6 rotates,the throttle gear 16, the yoke 43, and both of the magnets 44, 45 rotatesuch that the magnetic field direction intersecting each sensor IC50(1), 50(2) varies according to the rotational angle. Accordingly, anoutput signal from each sensor IC 50(1), 50(2) varies. The control meanssuch as ECU (not shown), to which each sensor IC 50(1), 50(2) outputsthe output signal, calculates the rotational angle of the throttle shaft6, or the opening degree of the throttle valve 12, based on the outputsignal from each sensor IC 50(1), 50(2).

Further, the control means such as ECU (not shown) controls theso-called control parameters for a fuel injection control, a control forcorrecting the opening degree of the throttle valve 12, a speed-changecontrol of an automatic transmission, etc., based on the throttleopening degree detected as the magnetic field direction representing themagnetic physical quantity of the pair of magnets 44, 45 and outputtedfrom each sensor IC 50(1), 50(2) of the rotational angle sensor Se, adriving speed detected by a vehicle speed sensor (not shown), an enginerotational speed detected by a crank angle sensor, a detection signalfrom an accelerator pedal sensor, an O₂ sensor, and an air flow meter,etc.

According to the rotational angle sensor Se (see FIGS. 2 and 3) providedin the aforementioned throttle control device TC, each connectionterminal 55, 56, 57 of each sensor IC 50(1), 50(2) for detecting arotational angle of the throttle gear 16 as a rotor is connected witheach main terminal 61, 62, 63, 64. Therefore, it is possible to lowerthe cost by using inexpensive main terminals 61, 62, 63, 64, comparingto expensive printed circuit boards that have conventionally beenrequired. Further, retaining the sensor ICs 50(1), 50(2) and theconnection portions of each main terminal 61, 62, 63, 64 on each sensorIC 50(1), 50(2) side in the holder member 90 may eliminate a molding diefor integrally resin molding the sensor ICs 50(1), 50(2) and the wiringterminals (equivalent to terminals integrally formed with the mainterminals and the subterminals (the sensor terminals)). Accordingly, itis possible to reduce the equipment expenses so as to lower the cost.

Further, constructing the sensor assembly 100 (see FIGS. 22 to 24) toform the sensor ICs 50(1), 50(2), the main terminals 61, 62, 63, 64 andthe holder member 90 into an assembly facilitates handling the sensorICs 50(1), 50(2) and the main terminals 61, 62, 63, 64. Further, it ispossible to reduce the size of the sensor assembly, because thestructure is more simplified than in using a printed circuit board.Accordingly, it is possible to reduce the equipment expenses so as tolower the cost.

Further, each connection terminal 55, 56, 57 of each sensor IC 50(1),50(2) and each main terminal 61, 62, 63, 64 are connected by welding(see welded portions 71 to 76 in FIG. 14). Thus, since the strength ofthe connection between each connection terminal 55, 56, 57 of eachsensor IC 50(1), 50(2) and each main terminal 61, 62, 63, 64 isenhanced, it is possible to prevent or reduce disconnection caused byrepeated temperature cycles. Additionally, it is possible to increasethe reliability of the rotational angle sensor Se.

Further, the guiding grooves 94 having the positioning grooves 94 a andthe tapered grooves 94 b (see FIG. 16) provided on the opposing innerwall surfaces of both the left and the right sidewalls 91 a, 91 b of theholder member, when the sensor ICs 50(1), 50(2) are inserted, may guideboth of the positioning pieces 54 of the magnetic sensing portions 51 ofthe sensor ICs 50(1), 50(2) to a predetermined assembled position. Morespecifically, since the opened ends of the guiding grooves 94 of theholder member 90 is provided with the tapered grooves 94 b (see FIG.16), the area where the positioning pieces 54 are engageable with thetapered grooves 94 b can be greater. Thus, it is possible to facilitateengaging the positioning pieces 54 of the magnetic sensing portions 51of the sensor ICs 50(1), 50(2) with the positioning grooves 94 a.Thereafter, the positioning pieces 54 are guided by the tapered grooves94 b toward the positioning grooves 94 a, and then the positioningpieces 54 are finally positioned at predetermined positions in thepositioning grooves 94 a. Thus, the sensor ICs 50(1), 50(2) can beeasily and accurately assembled in the predetermined assembled positionswithin the holder member 90 (see FIG. 19). Accordingly, it is possibleto prevent or reduce displacement of each sensor IC 50(1), 50(2). Thus,it is possible to facilitate assembling the sensor ICs 50(1), 50(2) andincrease the detection accuracy and the reliability of the rotationalangle sensor Se.

Further, a potting material 102 is potted into the holder member 90 soas to cover each sensor IC 50(1), 50(2), and the connection portionsbetween each connection terminal 55, 56, 57 of each sensor IC 50(1),50(2) and each main terminal 61, 62, 63, 64. Thus, it is possible toprevent the intrusion of moisture to the electrically conductiveportions so as to prevent or reduce the occurrence of shunt or short andmigration. Additionally, when the potting material 102 has flexibility,it is possible to protect each sensor IC 50(1), 50(2) from thermalstress, vibrations and the like. Additionally, since no excess pressureis applied to each sensor IC 50(1), 50(2) when it is potted, it ispossible to avoid characteristic changes of each sensor IC 50(1), 50(2)caused by the pressure. For these reasons, it is possible to increasethe reliability of the rotational angle sensor Se. Further, when aprinted circuit board is used, covering the printed circuit boardrequires plenty of potting material 102, but conversely, covering ormolding the connection portions between each connection terminal 55, 56,57 of each sensor IC 50(1), 50(2) and each main terminal 61, 62, 63, 64with a potting material 102 within a space surrounded by the holdermember 90 reduces the potting material 102 used such that it is possibleto lower the material cost for the potting material. Further, unlike inthe case of integrally resin molding (primary molding) each sensor IC50(1), 50(2) and each sensor terminal 111, 112, 113, 114, here it ispossible to reduce the equipment expenses for a resin molding die so asto lower the cost. Further, it is possible to prevent or reducedefective moldings due to a displacement between each sensor IC 50(1),50(2) and each main terminal 61, 62, 63, 64 caused by molding pressurein resin molding, a deformation of each connection terminal 55, 56, 57of each sensor IC 50(1), 50(2) and each main terminal 61, 62, 63, 64 andthe like. Further, using an epoxy resin, which is less expensive than asilicon-type UV curable resin, as the potting material 102 can avoidincreasing the cost. It should be noted that the silicon-type UV curableresin could be adopted as the potting material 102.

Further, each capacitor 81, 82, 83, 84, provided as a preventive measurefor discharge of positive charges; is connected between one and anotherof the main terminal 61, 62, 63, 64 and covered with the pottingmaterial 102 (see FIG. 19). Thus, the potting material 102 havingflexibility may protect the capacitors 81, 82, 83, 84 from thermalstress, vibrations and the like. Further, since no excess pressure isapplied to the capacitors 81, 82, 83, 84 when they are potted, it ispossible to avoid disconnection, destruction and the like of thecapacitors 81, 82, 83, 84 caused by the pressure. Accordingly, it ispossible to increase the reliability of the rotational angle sensor Se.

Further, the housed portions of the main terminals 61, 62, 63, 64 forconnecting the sensor ICs 50(1), 50(2) and the capacitors 81, 82, 83, 84are formed in stepped manner with the exposed portions of the mainterminals 61, 62, 63, 64 for the sensor terminals 111, 112, 113, 114,such that the exposed portions are disposed on the opening side of theholder member 90, while the housed portions are housed with the sensorICs 50(1), 50(2) and the capacitors 81, 82, 83, 84 in the holder memberin such a manner that the housed portions are closer to the bottom inthe holder member 90 than the exposed portions. Thus, it is possible toeasily and securely pot the potting material 102 against portions thatneed to be water-resistant for electrically conductive portionsincluding the sensor ICs 50(1), 50(2) and the capacitors 81, 82, 83, 84.Accordingly, it is possible to prevent or reduce the occurrence of shortcaused in electrically conductive portions.

Further, the resin molded cover 30 (see FIGS. 2 and 3) is provided,which is resin molded in such a manner that the sensor assembly 100 isinsert molded with the sensor terminals 111, 112, 113, 114, which areconnected to the terminal connections 61 a, 62 a, 63 a, 64 a of the mainterminals 61, 62, 63, 64 of the sensor assembly 100 and connectable withterminal pins of an external connector (not shown). Thus, it is possibleto facilitate disposing the sensor assembly 100 and the sensor terminals111, 112, 113, 114 into the cover 30. Further, since the main terminals61, 62, 63, 64 and the sensor terminals 111, 112, 113, 114 of the sensorassembly 100 are configured to be connected, it is possible to use thecommon sensor assembly 100 for the cover 30, even if the cover 30 isdifferent in the connection positions and the connection directions ofthe external connector (i.e., the molding positions and the moldingdirections of the connector portion 40), the wire routings of the sensorterminals 111, 112, 113, 114 and the like.

Further, since the sensor terminals 111, 112, 113, 114 and the plateterminals 37, 38 are integrated into the cover 30 by integrally resinmolding, it is possible to accurately dispose the sensor terminals 111,112, 113, 114 and the plate terminals 37, 38 in a predetermined positionin the cover 30.

Further, the aforementioned method for manufacturing the rotationalangle sensor Se includes the steps of: press molding an electricallyconductive sheet stock so as to form the main terminal unit 60 in whichthe main terminals 61, 62, 63, 64 are connected via the tie bars 65, 66,67, 68; connecting the connection terminals 55, 56, 57 of the sensor ICs50(1), 50(2) with the main terminal unit 60 so as to form the mainterminal assembly 70; disposing the sensor ICs 50(1), 50(2) of the mainterminal assembly 70 and the connection portions of the main terminals61, 62, 63, 64 on the sensor IC 50(1), 50(2) side to be housed into theholder member 90; and removing the tie bars 65, 66, 67 from the mainterminal unit 60. Therefore, according to the method for manufacturingthe rotational angle sensor Se, press molding a sheet stock so as toform the main terminal unit 60 enables the main terminals 61, 62, 63, 64to be accurately molded. Further, connecting the connection terminals55, 56, 57 of the sensor ICs 50(1), 50(2) with the main terminal unit 60so as to form the main terminal assembly 70 enables the connectionterminals 55, 56, 57 of the sensor ICs 50(1), 50(2) to be accuratelyconnected with the main terminals 61, 62, 63, 64. Further, disposing thesensor ICs 50(1), 50(2) of the main terminal assembly 70 and theconnection portions of the main terminals 61, 62, 63, 64 on the sensorIC 50(1), 50(2) side to be housed into the holder member 90 enables thesensor ICs 50(1), 50(2) to be easily disposed in position within theholder member 90 in such a way that the sensor ICs 50(1), 50(2) aresupported on the main terminal assembly 70. Further, removing the tiebars 65, 66, 67, 68 from the main terminal unit 60 enables the mainterminals 61, 62, 63, 64 to be easily formed separately. Therefore, therotational angle sensor Se can be reasonably manufactured.

Further, the throttle control device TC (see FIG. 1) is constructed toinclude the rotational angle sensor Se so as to detect opening degreesof the throttle valve 12. Therefore, it is possible to provide thethrottle control device TC including the rotational angle sensor Se thatcan lower the cost.

Further, the magnetic field direction generated between the pair ofmagnets 44, 45 disposed in the throttle shaft 6 is detected by thesensor ICs 50(1), 50(2) of the rotational angle sensor Se such that theopening degrees of the throttle valve 12 are detected based on theoutputs from the sensor ICs 50(1), 50(2) (see FIGS. 3 and 4). Therefore,the sensor ICs 50(1), 50(2) detecting the magnetic field direction arehardly affected, for example, by displacement of the magnet 44, 45 dueto displacement of the throttle shaft 6, magnetic field intensity changedue to the temperature characteristics of the magnets 44, 45 and thelike. It should be noted that the displacement of the throttle shaft 6is referred to as a relative displacement against the sensor ICs 50(1),50(2), which is generated by assembly errors of the throttle shaft 6,thermal expansion errors between the throttle body 1 and the cover 30,rattling due to wearing of the throttle shaft 6 or the bearings 8, 10,thermal expansion of the resin (the throttle gear 16) molded by insertmolding both of the magnets 44, 45 and the like. Thus, it is possible toaccurately detect the magnetic field direction by the sensor ICs 50(1),50(2), and accordingly it is possible to increase the detection accuracyof the opening degrees of the throttle valve 12. This is particularlyadvantageous if the throttle body 1 is made of a resin that isinsufficient in manufacturing accuracy. Further, this is advantageous ifthe throttle body 1 and the cover 30 are made in different materials,for example, in the case that the throttle body 1 is made of metal,while the cover 30 is made of resin.

Further, the pair of magnets 44, 45 disposed in the throttle shaft 6 aredisposed in the throttle gear 16 and on the inner surface of the yoke 43made of a ring-shaped magnetic material generally centered about therotational axis L, and also parallel magnetized such that the magneticfields generated between both are formed in a parallel relationship (seeFIG. 4). Therefore, since a magnetic circuit including the pair ofmagnets 44, 45 and the yoke 43 so as to parallel magnetize the pair ofmagnets 44, 45, the magnetic field generated between the magnets 44, 45are substantially parallel. Thus, it is possible to further increase thedetection accuracy of the magnetic field direction by the sensor ICs50(1), 50(2).

Second Embodiment

A second embodiment of the present invention will be described. Sincethis embodiment is a modification of the main terminal assembly 70 (seeFIGS. 13 and 14) of the first embodiment, the same description will notbe duplicated further, but a modified part will be described. It shouldbe noted that FIG. 32 is a front view showing the sensor assembly 100;FIG. 33 is a cross-sectional view taken along line E-E in FIG. 32; andFIG. 34 is a rear view showing the sensor assembly 100. As shown inFIGS. 32 to 34, the main terminal unit 60 of the main terminal assembly70 of this embodiment is provided with the capacitors 81, 82, 83, 84 tobe mounted on the same side as the connection side, i.e., the frontside, of the sensor ICs 50(1), 50(2). Thus, the main terminals 61, 62,63, 64 of the main terminal unit 60 are folded such that the capacitorconnections 61 b, 62 b, 63 b, 64 b, 64 d, 64 f are disposed on plane F5on the reverse side of the capacitors 81, 82, 83, 84 of the firstembodiment. Functions and effects similar to those of the firstembodiment are obtained by the second embodiment configured as above.Additionally, since the capacitors 81, 82, 83, 84 are disposed on thesame side as the connection side of the sensor ICs 50(1), 50(2) in themain terminals 61, 62, 63, 64, the sensor ICs 50(1), 50(2) and thecapacitors 81, 82, 83, 84 are easily disposed against the main terminals61, 62, 63, 64.

Third Embodiment

A third embodiment of the present invention will be described. Sincethis embodiment is a modification of the rotational angle sensor Se ofthe first embodiment, the same description will not be duplicatedfurther, but a modified part will be described. As shown in FIG. 35, therotational angle sensor Se includes a cover (designated as 230), whichis intended to be connected on the lateral surface of the throttle body1 of the throttle control device TC in a way similar to the firstembodiment. It should be noted that the cover 230 is equivalent to the“resin molded body” herein.

The motor 20 incorporated into the throttle body 1 includes two motorterminals 35 (only one of which is shown in FIG. 35), which arerespectively connected with relay connectors 236 provided in the cover30 (see FIG. 38). One (the upper side as viewed in FIG. 38) of the relayconnectors 236 is connected with a connector connection end 237 a of afirst plate terminal 237 (see FIGS. 79 and 80), which is insert moldedor inserted to be resin molded into the cover 230. Further, the other(the lower side as viewed in FIG. 38) of the relay connectors 236 isconnected with a connector connection end 238 a of a second plateterminal 238 (see FIGS. 81 and 82), which is insert molded or insertedto be resin molded into the cover 230. It should be noted that FIG. 79is a front view showing the first plate terminal 237, while FIG. 80 is aright side view showing the same. Further, FIG. 81 is a front viewshowing the second plate terminal 238, while FIG. 82 is a right sideview showing the same. Further, the outer surface of each plate terminal237, 238 is plated with Ni (not shown).

Further, as shown in FIG. 38, an external connection end 237 b, 238 b ofeach plate terminal 237, 238 projects into a substantiallyhorizontally-rectangular cylinder shaped connector portion 240, which isformed in a predetermined portion (the lower portion as viewed in FIG.38) of the cover 230 (see FIG. 37). Further, the connector portion 240of the cover 230 is connectable with an unshown external connector.Further, the external connection end 237 b, 238 b of the plate terminals237, 238, and external connection ends 111 b, 112 b, 113 b, 114 b of thesensor terminals 111, 112, 113, 114 that will be later described, areconnectable both with the external connector (not shown) for theconnector portion 240 and with each terminal pin (not shown) within theexternal connector.

As shown in FIG. 38, the relay connectors 236 and the plate terminals237, 238, as well as a sensor terminal assembly 320 (later described,see FIG. 78), are insert molded or inserted to be resin molded into thecover 230. Further, as shown in FIG. 77, the sensor terminal assembly320 consists of the sensor assembly 300 and the sensor terminal unit310. The sensor terminal assembly 320 is formed when each tie bar 115 a,115 b, 115 c, 116 a, 116 b, 116 c (later described) is removed from thesensor terminal unit 310 (see FIG. 78). Further, as shown in FIGS. 69and 70, the sensor assembly 300 consists of the main terminal assembly270 and the holder member 290. The sensor assembly 300 is formed wheneach tie bar 265, 266, 267, 268 (later described) is removed from themain terminal assembly 270 (see FIGS. 73 and 74).

For convenience of description, the main terminal assembly 270, theholder member 290, the sensor assembly 300, the sensor terminal unit310, the sensor terminal assembly 320 and the cover 230 will bedescribed below in this order. It should be noted that the components ofthe sensor assembly 300 are shown in FIG. 68 in an exploded perspectiveview. Further, in this embodiment, the main terminal assembly 270, theholder member 290, the sensor assembly 300, the sensor terminal unit 310and the sensor terminal assembly 320 are described in such a way thatthe front side (the right side as viewed in FIG. 35) of the cover 230 isregarded as the forward side (the front side), while the reverse side(the left side as viewed in FIG. 35) of the cover 230 is regarded as theback side (rear side).

Firstly, the main terminal assembly 270 will be described. It should benoted that FIG. 57 is a front view showing the main terminal assembly270; FIG. 58 is a cross-sectional view taken along line H-H in FIG. 57;FIG. 59 is a cross-sectional view taken along line I-I in FIG. 57; andFIG. 60 is a cross-sectional view taken along line J-J in FIG. 57. Asshown in FIGS. 57 to 60, the main terminal assembly 270 consists of twosensor ICs 250(1), 250(2), one main terminal unit 260 and fourcapacitors 81, 82, 83, 84 (see FIG. 68). Two of the same sensor ICs 250are used as the two sensor ICs 250(1), 250(2). As shown in FIGS. 40 to42, the sensor IC 250, which is the same as in the first embodiment (seeFIGS. 6 and 7), includes a magnetic sensing portion 251 and a computingportion 252, which is arranged in the front (the left side as viewed inFIGS. 40 to 42) of the magnetic sensing portion 251 via six connectingterminals 253. The magnetic sensing portion 251 of this embodimentincludes magnetoresistive elements embedded in a resin shell such thatboth the left and the right sides of the shell are provided with metalpositioning pieces 254, which project symmetrically from both the leftand right sides (symmetrically about the left-right axis as viewed inFIG. 40). Further, the computing portion 252 includes an inputconnection terminal 255, a ground connection terminal 256 and an outputconnection terminal 257 projecting parallel to each other and forward(leftward as viewed in FIGS. 40 to 42). It should be noted that thesensor IC 250 is equivalent to the “magnetic detector” herein.

As shown in FIGS. 43 and 44, one sensor IC 250 of the two sensor ICs 250is formed as a first sensor IC 50(1), the connecting terminals 253 ofwhich are folded such that the magnetic sensing portion 251 is inclinedtoward the front side (upward as viewed in FIG. 43) at an angle ofapproximately 90 degrees. The tips of the connection terminals 255, 257disposed on both sides of the first sensor IC 250(1) are spread in aparallel relationship with each other such that the spacings therefromto the middle-positioned connection terminal 256 are widened (see FIG.44). Further, as shown in FIGS. 45 and 46, the other sensor IC 250 isformed as a second sensor IC 250(2), the connecting terminals 253 ofwhich are folded such that the magnetic sensing portion 251 is inclinedtoward the reverse side (downward as viewed in FIG. 46) at an angle ofapproximately 90 degrees. The tips of the connection terminals 255, 257disposed on both sides of the second sensor IC 250(2) are spread in aparallel relationship with each other similar to the first sensor IC250(1), such that the spacings therefrom to the middle-positionedconnection terminal 256 are widened (see FIG. 45).

Then, the capacitors 281, 282, 283, 284 will be described. The samecapacitor 280 is used for each capacitor 281, 282, 283, 284 (see FIG.68). As shown in FIG. 52, the capacitor 280 includes a capacitor body280 a, two leads 280 b, 280 c bilaterally extending upward from thecapacitor body 280 a. The proximal end of each lead 280 b, 280 c issupported by supporting portions 280 d, 280 e, which are integrallyformed on the top surface of the shell of the capacitor body 280 a. Itshould be noted that each capacitor 281, 282, 283, 284 serves as apreventive measure for discharge of positive charges, similar to eachcapacitor 81, 82, 83, 84 of the first embodiment, such that highvoltages due to static electricity may not be applied to the respectivesensor ICs 250(1), 250(2).

The same capacitor 280(1) is used for two capacitors 283, 283 of thefour capacitors 281, 282, 283, 284, while the same capacitor 280(2) isused for the remaining two capacitors 281, 284 (see FIGS. 55 and 56). Asshown in FIGS. 53 and 54, one capacitor 280(1) is configured to have theleft-side lead 280 b inclined in the left oblique direction and alsoboth tips of the leads 280 b, 280 c parallel folded in the forwarddirection (leftward in FIG. 54). Further, as shown in FIGS. 55 and 56,the other capacitor 280(2) is configured to have the right-side lead 280c inclined in the right oblique direction and also both tips of theleads 280 b, 280 c parallel folded in the forward direction (leftward inFIG. 54).

Next, the main terminal unit 260 will be described. It should be notedthat FIG. 47 is a perspective view showing the main terminal unit 260;and FIG. 48 is a development view showing the same. Further, FIG. 49 isa front view showing the main terminal unit; FIG. 50 is a right sideview showing the same; and FIG. 51 is a cross-sectional view taken alongline G-G in FIG. 49. The main terminal unit 260 is formed by pressmolding an electrically conductive sheet stock such as a copper alloyplate. As shown in FIG. 48, the main terminal unit 260 includes a signalinput (referred to as Vc hereafter) main terminal 261, a signal output(referred to as V1 hereafter) main terminal 262, a signal output(referred to as V2 hereafter) main terminal 263, and a ground (referredto as GND hereafter) main terminal 264. Terminal connections 261 a, 262a, 263 a, 264 a (later described) of the main terminals 261, 262, 263,264 are connected with each other by tie bars 265, 266, 267, 268, whichform a substantially square frame-like shape.

More specifically, referring to FIG. 48, the Vc main terminal 261includes the terminal connection 261 a disposed in the middle portion onthe left side of the main terminal unit 260. Further, the V1 mainterminal 262 includes the terminal connection 262 a disposed in theupper portion on the left side. Further, the V2 main terminal 263includes the terminal connection 263 a disposed in the lower portion onthe left side. Further, the GND main terminal 264 includes the terminalconnection 264 a disposed in the middle portion on the right side. Then,the upper tie bar 265 is configured in a substantially inverted-U-shapeso as to connect the terminal connection 262 a disposed in the upperportion on the left side with the terminal connection 264 a disposed inthe middle portion on the right side. Further, the lower tie bar 65 isconfigured in a substantially U-shape so as to connect the terminalconnection 61 a disposed in the middle portion on the right side withthe terminal connection 62 a disposed in the lower portion on the leftside. Further, the upper left tie bar 267 is configured in a straightline so as to connect the terminal connection 262 a disposed in theupper portion on the left side with the terminal connection 261 adisposed in the middle portion on the left side. Further, the lower lefttie bar 268 is configured in a straight line extending downwardly andserially from the upper left tie bar 267, so as to connect the terminalconnection 261 a disposed in the middle portion on the left side withthe terminal connection 263 a disposed in the lower portion on the leftside.

Referring to FIG. 48, the Vc main terminal 261 includes the terminalconnection 261 a, as well as an upper IC terminal connection 261 c and alower IC terminal connection 261 d. The upper IC terminal connection 261c extends upward from the right end of the terminal connection 261 a.Further, the lower IC terminal connection 261 d, which extends downwardfrom the right end of the terminal connection 261 a, is formedsymmetrically about the upper IC terminal connection 261 c as theleft-right axis.

Further, the V1 main terminal 262 includes the terminal connection 262a, as well as an IC terminal connection 262 c. The IC terminalconnection 262 c extends downward from the right end of the terminalconnection 262 a.

Further, the V2 main terminal 263, which includes the terminalconnection 263 a, as well as an IC terminal connection 263 c, is formedsymmetrically about the V1 main terminal 262 as the left-right axis.Thus, the IC terminal connection 263 c extends downward from the rightend of the terminal connection 263 a.

Further, the GND main terminal 264 includes the terminal connection 264a, as well as an upper IC terminal connection 264 c and a lower ICterminal connection 264 e. The upper IC terminal connection 264 c, whichextends upward from the left end of the terminal connection 264 a, isformed in a predetermined spaced relationship between the upper ICterminal connection 261 c and the IC terminal connection 262 c. Further,the lower IC terminal connection 264 e is formed symmetrically about theupper IC terminal connection 264 e as the left-right axis. Thus, thelower IC terminal connection 264 e, which extends downward from the leftend of the terminal connection 264 a, is formed in a predeterminedspaced relationship between the lower IC terminal connection 261 d andthe IC terminal connection 263 c.

Thus, the tips of the IC terminal connections 261 c, 261 d, 262 c, 263c, 264 c, 264 e of the main terminals 261, 262, 263, 264 are enlarged ina substantially square shape. Then, both of the tips of the IC terminalconnections 261 c, 261 d of the Vc main terminal 261 are folded forwardand parallel to each other (see FIGS. 47 and 49). Further, the tip ofthe IC terminal connection 262 c of the V1 main terminal 262 and the tipof the IC terminal connection 263 c of the V2 main terminal 263 arefolded forward (leftward in FIG. 50) and parallel to each other.Further, both of the tips of the IC terminal connections 262 c, 264 e ofthe GND main terminal 264 are folded forward (leftward in FIG. 50) andparallel to each other. Additionally, the tips of the IC terminalconnections 261 c, 262 c, 264 c on the upper side are provided on thesame plane F11 (see FIGS. 49 and 50). Further, the tips of the ICterminal connections 261 d, 263 c, 264 e on the lower side are providedon the same plane F12 (see FIGS. 49 and 50). It should be noted thateach IC terminal connection 261 c, 261 d, 262 c, 263 c, 264 c, 264 edoubles as the “capacitor connection” in this embodiment.

Further, the external ends of the terminal connections 261 a, 262 a, 263a, 264 a (see FIGS. 50 and 47) and the tie bars 265, 266, 267, 268 areprovided on the same plane F13 (see FIGS. 50 and 53), which is displacedforward (leftward in FIG. 50) from the IC terminal connections 261 c,261 d, 262 c, 263 c, 264 c, 264 e. Further, the intermediate portionsbetween the external ends of the terminal connections 261 a, 262 a, 263a, 264 a and the tips of the IC terminal connections 261 c, 261 d, 262c, 263 c, 264 c, 264 e are provided on the same plane F14 (see FIGS. 50and 53), which is displaced rearward (rightward in FIG. 50) from thetips of the IC terminal connections 261 c, 261 d, 262 c, 263 c, 264 c,264 e.

Further, as shown in FIG. 50, the middle portion of the top of the uppertie bar 265 is provided with a stepped portion 265 a, which is disposedon plane F14 displaced reward (rightward in FIG. 50) (see FIG. 47).Further, the middle portion of the top of the lower tie bar 266 isprovided with a stepped portion 266 a, which is disposed on plane F14displaced rearward (rightward in FIG. 50) (see FIG. 47).

As described above, since each portion is provided on predeterminedplanes F14, F15, the interconnection between these portions is providedwith a folded portion, which extends from the front to the reverse.Thus, referring to FIG. 47, the terminal connection 262 a and the ICterminal connection 262 b of the V1 main terminal 262 are formed in astepped shape via a folded portion 269 a. Further, the terminalconnection 263 a and the IC terminal connection 263 c of the V2 mainterminal 263 are formed in a stepped shape via a folded portion 269 b.Further, the terminal connections 264 a and both of the IC terminalconnections 264 c, 264 e of the GND main terminal 264 are formed in astepped shape via a folded portion 269 c. Further, the terminalconnection 261 a and both of the IC terminal connections 261 c, 261 d ofthe Vc main terminal 261 are formed in a stepped shape via a foldedportion 269 f. Further, the upper tie bar 265 is provided with a steppedportion 265 a via both folded portions 269 d on the left and the rightsides. Further, the lower tie bar 266 is provided with a stepped portion66 a via both folded portions 269 e on the left and the right sides. Itshould be noted that the outer surface of the main terminal unit 260 isplated with Ni (not shown).

It should be noted that each IC terminal connection 61 c, 61 d, 62 c, 63c, 64 c, 64 e of the main terminals 61, 62, 63, 64 is equivalent to the“magnetic-detector-side connection portion” and the “housed portion”herein. Further, the external end of each terminal connection 261 a, 262a, 263 a, 264 a is equivalent to the “exposed portion” herein. Then, thehoused portion and the exposed portion are formed in a stepped shape viaeach folded portion 269 a, 269 b, 269 c, 269 f.

The main terminal assembly 270 will now be described. As shown in FIGS.57 to 60, the main terminal assembly 270 is configured such that themain terminal unit 260 is implemented with the sensor ICs 250(1), 250(2)and the capacitors 281, 282, 283, 284. Thus, the first sensor IC 250(1)and the second sensor IC 250(2) are oppositely disposed on the reverse(rear) of the main terminal unit 260, such that the magnetic sensingportion 251 of the second sensor IC 250(2) is overlapped against therear side (the right side as viewed in FIG. 58) of the magnetic sensingportion 251 of the second sensor IC 250(2). Accordingly, on the reverseside (the rear side) of the main terminal unit 260, the capacitor 282(2)as a first capacitor 281 is disposed such that the leads 280 b, 280 care directed downward, while the capacitor 280 (1) as a second capacitor282 is disposed such that the leads 280 b, 280 c are directed upward.Additionally, on the reverse side (the rear side) of the main terminalunit 260, the capacitor 280(1) as a third capacitor 283 is disposed suchthat the leads 280 b, 280 c are directed downward, while the capacitor280 (2) as a fourth capacitor 284 is disposed such that the leads 280 b,280 c are directed upward.

Under these conditions, the output connection terminal 257 of the firstsensor IC 250(1) and the lead 280 b of the second capacitor 282(equivalent to the capacitor 280(1)) are electrically connected with thebottom surface of the tip of the lower IC terminal connection 261 d inthe Vc main terminal 261 of the main terminal unit 260 by welding (notdesignated). It should be noted that the lead 280 b of the secondcapacitor 282 is arranged on the left side of the output connectionterminal 257 (see FIG. 59). Further, the ground connection terminal 256of the first sensor IC 250(1) and the lead 280 c of the second capacitor282 (equivalent to the capacitor 280(2)) are electrically connected withthe bottom surface of the tip of the lower IC terminal connection 264 ein the GND main terminal 264 of the main terminal unit 260 by welding(not designated). It should be noted that the lead 280 c of the secondcapacitor 282 is arranged on the left side of the ground connectionterminal 256, while the lead 280 b of the fourth capacitor 284 isarranged on the right side of the ground connection terminal 256 (seeFIG. 59). Further, the input connection terminal 255 of the first sensorIC 250(1) and the lead 280 c of the fourth capacitor 284 areelectrically connected with the bottom surface of the tip of the ICterminal connection 263 c in the V2 main terminal 263 of the mainterminal unit 260 by welding (not designated). It should be noted thatthe lead 280 c of the fourth capacitor 284 is arranged on the right sideof the output connection terminal 257 (see FIG. 59).

Further, the output connection terminal 257 of the second sensor IC250(2) and the lead 280 c of the first capacitor 281 (equivalent to thecapacitor 280(2)) are electrically connected with the top surface of thetip of the upper IC terminal connection 261 c in the Vc main terminal261 of the main terminal unit 260 by welding (not designated). It shouldbe noted that the lead 280 c of the first capacitor 281 is arranged onthe left side of the output connection terminal 257 (see FIG. 59).Further, the ground connection terminal 256 of the second sensor IC250(2) and the lead 280 b of the third capacitor 283 (equivalent to thecapacitor 280(1)) are electrically connected with the top surface of thetip of the upper IC terminal connection 264 c in the GND main terminal264 of the main terminal unit 260 by welding (not designated). It shouldbe noted that the lead 280 b of the first capacitor 281 is arranged onthe left side of the ground connection terminal 256, while the lead 280c of the third capacitor 283 is arranged on the right side of the groundconnection terminal 256 (see FIG. 60). Further, the input connectionterminal 255 of the second sensor IC 250(2) and the lead 280 b of thethird capacitor 283 are electrically connected with the top surface ofthe tip of the IC terminal connection 262 c in the V1 main terminal 262of the main terminal unit 260 by welding (not designated). It should benoted that the lead 280 b of the third capacitor 283 is arranged on theright side of the output connection terminal 257 (see FIG. 60). Asdescribed above, the IC terminal connections 261 c, 261 d, 262 c, 263 c,264 c, 264 e of the main terminal unit 260, the connection terminals255, 256, 257 of the sensor ICs 250(1), 250(2), and the connections ofthe leads 280 b, 280 c of the capacitors 281,282,283,284 are arranged inupper-and-lower two rows.

Meanwhile, the welding includes spot welding or resistance welding, forexample. When welding, a jig 286 (see FIGS. 61 and 62) is used forpositioning the main terminal unit 260, the sensor ICs 250(1), 250(2)and the capacitors 281, 282, 283, 284 in position. Thus, this jig 286 isconfigured to allow the capacitors 281, 282, 283, 284 to be positionedas described below. It should be noted that, since the capacitors 281,283 arranged in an upper row and the capacitors 282, 284 arranged in thelower row are retained symmetrically about the left-right axis, theretaining structure for the lower left capacitor 282 (280(1)) will bedescribed, while the retaining structures for the other capacitors 281,283, 284 will be omitted.

As shown in FIG. 64, the jig 286 is provided with a predetermined number(e.g., three) of first positioning pins 287, which are arranged acrossthe leads 280 b, 280 c of the capacitor 280. The spacing between theadjacent ones of the first positioning pins 287 is formed as a spacingthat can be positioned by fitting each lead 280 b, 280 c of thecapacitor 280 therebetween. Accordingly, the jig 286 is provided with apositioning pin 288 that can perform the positioning by relativelyinserting it between the supporting portions 280 d, 280 e of thecapacitor body 280 a of the capacitor 280. It should be noted that theaxes of both of the positioning pins 287, 288 extend orthogonal to theplane of the drawing as viewed in FIG. 64. Therefore, it is possible toposition the capacitor 280 in position by relatively inserting thepositioning pin 288 of the jig 286 between the supporting portions 280d, 280 e of the capacitor body 280 a, and also by inserting the leads280 b, 280 c between the adjacent ones of the first positioning pins287.

When spot welding or resistance welding is used, a welding head 297 (seeFIG. 63), which includes a pair of welding electrodes 298, 299 that canbe opened and closed, moved from the left to the right along the upperrow directions, for example, shown by arrow Y in FIG. 61, while theupper row is welded in step-by-step manner. Subsequently, the weldinghead 297 is moved to the lower, and then is moved from the right to theleft along the lower row directions, while the lower row is welded instep-by-step manner.

Next, the holder member 290 will be described. It should be noted thatFIG. 65 is a front view showing the holder member 90; FIG. 66 is across-sectional view taken along line M-M; and FIG. 67 is a rear viewshowing the holder member 290. The holder member 290, which is, forexample, made of resin, is configured to mainly have a closed-endelliptical cylinder shaped hollow tube portion 291 that closes the frontside and opens the rear side (see FIG. 66). The front side (the leftside in FIG. 66) of the hollow tube portion 291 is provided continuouslywith an enlarged tube portion 293 such that the opening is enlarged viaan intermediate end plate portion 292 in a longitudinally rectangularplate shape. The intermediate end plate portion 292 extends from theouter surface of the hollow tube portion 291 upward, downward, leftwardand rightward. Further, the intermediate end plate portion 292 isprovided with upper-end and lower-end corner portions, in whichretaining recesses 295 that are substantially U-shaped surroundinggrooves are formed symmetrically about the left-right axis (see FIG.68).

Guiding grooves 294 are provided in the middle portion of the opposedwall surfaces of both the left and the right sidewalls 291 a, 291 b (seeFIG. 67) of the hollow tube portion 291 in such a manner that thegrooves 294 extend in the front-rear direction (the left-right directionin FIG. 66). It should be noted that the guiding grooves 294 areequivalent to the “guiding portions” herein. More specifically,referring to FIG. 66, the bottom ends of the guiding grooves 294 (theends on the bottom end surface 291 e side of the hollow tube portion291) are, similar to the first embodiment, formed as positioning grooves294 a, the widths (the widths extending in the up-down direction in FIG.65) of which are configured to receive both the positioning pieces 254(see FIGS. 40 to 42) on the left and the right sides of the magneticsensing portions 51 (see FIG. 58) of the sensor ICs 50(1), 50(2).Further, the portions extending from the positioning grooves 294 a ofthe guiding grooves 294 to the opening end surface (leftward in FIG. 66)of the hollow tube portion 291 are formed as tapered grooves 294 b, thewidths (the widths extending in the up-down direction in FIG. 66) ofwhich are configured in a tapered shape so as to be gradually enlargedfrom the positioning grooves 294 a to the opening end surface of thehollow tube portion 291. Further, the spacing defined between both theleft and the right sidewalls 291 a, 291 b of the hollow tube portion 91(see FIG. 67) is configured to receive the respective sensor ICs 250(1);250(2), or to be slightly wider than the width (the width extending inthe up-down direction in FIGS. 40 and 42) of the magnetic sensingportion 251 and the computing portion 252 of the respective sensor ICs50(1), 50(2).

The bottom end surface 291 e of the hollow tube portion 291 is formedwith a predetermined spacing S along the contour shape of the respectivesensor ICs 50(1), 50(2) facing to the bottom end surface 291 e. Itshould be noted that the bottom end surface 291 e of the holder member290 is equivalent to the “bottom surface” herein. Further, the contourshape of the respective sensor ICs 50(1), 50(2) facing the bottom endsurface 291 e is equivalent to the periphery of the magnetic sensingportion 251 of the first sensor IC 250(1) and the periphery of themagnetic sensing portion 251 of the second sensor ICs 250(2) that isexposed toward the rear side from the magnetic sensing portion 251 ofthe first sensor IC 250(1).

Further, as shown in FIG. 65, the opposed wall surfaces of both the leftand the right sidewalls 293 a, 293 b of the enlarged tube portion 293are provided with an appropriate number of linear reinforcing ribs 296(six ribs respectively on the left and the right sides shown in FIGS. 65and 66), which extend in the front-rear direction (the left-rightdirection) and in a predetermined spaced relationship in the up-downdirection, while projecting symmetrically from the left and right sides.Additionally, the front-end surface of the left sidewall 293 a of theenlarged tube portion 293 is provided with three engaging grooves 293 c,293 d, 293 e disposed respectively in upper, middle and lower portions.The upper engaging groove 293 c is engageable with the middle portion ofthe terminal connection 262 a (see FIG. 47) of the V1 main terminal 262disposed on plane F13 (see FIGS. 50 and 51) in the main terminal unit260. Further, the middle engaging groove 293 d is engageable with themiddle portion of the terminal connection 261 a (see FIG. 47) of the Vcmain terminal 261 disposed on plane F13 (see FIGS. 50 and 51) in themain terminal unit 260. Further, the lower engaging groove 293 e isengageable with the middle portion of the terminal connection 263 a (seeFIG. 47) of the V2 main terminal 263 disposed on plane F13 (see FIGS. 50and 51) in the main terminal unit 260. Further, the front-end surface ofthe right sidewall 293 b of the enlarged tube portion 293 is providedwith one engaging groove 293 f. The engaging groove 293 f is engageablewith the middle portion of the terminal connection 264 a (see FIG. 47)of the GND main terminal 264 disposed on plane F13 (see FIGS. 50 and 51)in the main terminal unit 260.

The sensor assembly 300 will now be described. It should be noted thatFIG. 69 is a front view showing the sensor assembly 300; and FIG. 70 isa cross-sectional view taken along line N-N in FIG. 69. The sensorassembly 300 includes the main terminal assembly 270 (see FIGS. 57 to60) and the holder member 290 (see FIGS. 65 and 66). As shown in FIG.70, each sensor IC 250(1), 250(2) of the main terminal assembly 270 isinserted into and housed in the hollow tube portion 291 of the holdermember 290. At this point, each positioning piece 254 (see FIGS. 43 and44) of the magnetic sensing portion 251 of the first sensor IC 250(1) isfitted into the tapered groove 294 b of each guiding groove 294 on theleft or the right of the holder member 290, guided toward apredetermined assembled position, and finally engaged into thepositioning groove 294 a (see FIG. 66) so as to be positioned in thepredetermined assembled position. Accordingly, the computing portion 252of the first sensor IC 250(1) abuts on the lower wall surface 291 e ofthe hollow tube portion 291 of the holder member 290 insurface-to-surface contacting manner (see FIG. 70).

Subsequently, each positioning piece 254 (see FIGS. 45 and 46) of themagnetic sensing portion 251 of the second sensor IC 250(2) is fittedinto the tapered groove 294 b of each guiding groove 294 on the left orthe right of the holder member 290, guided toward a predeterminedassembled position, and finally engaged into the positioning groove 294a (see FIG. 66) so as to be positioned in the predetermined assembledposition. Accordingly, the computing portion 252 of the second sensor IC250(2) abuts on the upper wall surface 291 c of the hollow tube portion291 of the holder member 290 in surface-to-surface contacting manner.

Further, as shown in FIGS. 69 and 70, the upper engaging groove 293 c(see FIGS. 65 and 66) on the left sidewall 293 a of the enlarged tubeportion 293 of the holder member 290 is engaged with the middle portionof the terminal connection 262 a of the V1 main terminal 262, the middleengaging groove 293 d (see FIGS. 65 and 66) is engaged with the middleportion of the terminal connection 261 a of the Vc main terminal 261,and the lower engaging groove 293 e (see FIGS. 65 and 66) is engagedwith the middle portion of the terminal connection 263 a of the V2 mainterminal 263. Accordingly, the engaging groove 293 f (see FIG. 65) ofthe right sidewall 293 b of the enlarged tube portion 293 is engagedwith the middle portion of the terminal connection 264 a of the GND mainterminal 264. Accordingly, the sensor assembly 300 is incorporated intothe holder member 90 in predetermined positioned manner (see FIGS. 69and 70).

Further, when each sensor IC 50(1), 50(2) is positioned by engaging eachengaging groove 293 c, 293 d, 293 e, 293 f of the enlarged tube portion293 of the holder member 290 with the middle portion of the terminalconnection 262 a, 261 a, 263 a, 264 a of each main terminal 262, 261,263, 264, the contour shape of the rear side of each sensor IC 50(1),50(2) represents a form configured with a predetermined spacing S alongthe bottom end surface 291 e of the hollow tube portion 291 of theholder member 290 (see FIG. 70). As described above, the center of themagnetic sensing portion 251 of each sensor IC 250(1), 250(2) is alignedwith an axis of the hollow tube portion 291 of the holder member 290(see FIGS. 69 and 70).

When each sensor IC 250(1), 250(2) is housed into the hollow tubeportion 291 of the holder member 290 as described above, the connectionportion between each connection terminal 255, 256, 257 of each sensor IC250(1), 250(2) with each main terminal 261, 262, 263, 264, and eachcapacitor 281, 282, 283, 284 (see FIGS. 57 to 60) etc. are housed intothe enlarged tube portion 293 of the holder member 290. Further, theexternal end of each terminal connection 261 a, 262 a, 263 a, 264 a andeach tie bar 265, 266, 267, 268 remain exposed from the enlarged tubeportion 293 of the holder member 290. Thus, when the external end ofeach terminal connection 261 a, 262 a, 263 a, 264 a (see FIGS. 57 to60), i.e., the exposed portion of each main terminal 261, 262, 263, 264,is disposed outside of the opening of the holder member 290, each ICterminal connection 261 c, 261 d, 262 c, 263 c, 264 c, 264 e (see FIGS.57 to 60), i.e., the housed portions, are housed into the holder member290 with each sensor IC 250(1), 250(2) and each capacitor 281, 282, 283,284, so as to be closer to the bottom than the exposed portion withinthe holder member 290 (see FIGS. 69 and 70).

Under these conditions, as shown in FIGS. 71 and 72, a potting material302 is substantially entirely within the holder member 290, for example,by a dispenser (not shown). More specifically, the potting material 302is potted into the holder member 290 so as to reach closer to eachengaging groove 293 c, 293 d, 293 e, 293 f of the holder member 290.Accordingly, each sensor IC 250(1), 250(2), each connection terminal255, 256, 257 thereof, each capacitor 281, 282, 283, 284, and the housedportion of each main terminal 261, 262, 263, 264 housed within theholder member 290 are buried with the potting material 302 (see FIGS. 71and 71).

Further, similar to the potting material 102 of the first embodiment, aresin such as an epoxy resin, which is permanently soft but insufficientto inadvertently drip, is adopted as the potting material 302 such thateach sensor IC 250(1), 250(2) and each capacitor 281, 282, 283, 284 areprotected from thermal stress, vibration and the like. Further, pottingthe potting material 302 into the hollow tube portion 291 of the holdermember 290 avoids the occurrence of distortions of the magnetic sensingportion 251 of each sensor IC 250(1), 250(2) such that declining of thedetection accuracy due to the occurrence of distortions can beprevented. Insert molding, for example, may lead to a problem ofdeclining of the detection accuracy because the magnetic sensing portion251 of each sensor IC 250(1), 250(2) is distorted by the insertingpressure of the resin, but it is possible to eliminate such a problem bypotting the potting material 302.

After potting the potting material 302, each tie bar 265, 266, 267, 268of the main terminal unit 260 is removed by cutting. Accordingly, asshown FIGS. 73 and 74, each separated main terminal 261, 262, 263, 264is formed from the main terminal unit 260. The sensor assembly 300configured as above serves as a basis of a rotational angle sensor(designated as Se). It should be noted that FIGS. 73 and 74 show thesensor assembly 300 in which the tie bars of the main terminal unit havebeen cut; (a) is a front view, while (b) is a cross-sectional view takenalong line B-B in (a).

Next, the sensor terminal unit 310 will be described. FIG. 75 is a frontview showing the sensor terminal unit 310; and FIG. 76 is a right sideview showing the same. The sensor terminal unit 310 is formed by pressmolding an electrically conductive sheet stock such as a copper alloyplate. As shown in FIG. 75, the sensor terminal unit 310 includes the Vcsensor terminal 311, the V1 sensor terminal 312, the V2 sensor terminal313, and the GND sensor terminal 314. Then, the adjacent sensorterminals 311, 312, 313, 314 are connected with each other by each tiebar 315 a, 315 b, 315 c, 316 a, 316 b, 316 c. More specifically,referring FIG. 75 in the order from the bottom to the top, the V1 sensorterminal 312, the Vc sensor terminal 311, the V2 sensor terminal 313,and the GND sensor terminal 314 are arranged parallel. The tie bars 315a, 315 b, 315 c, which are disposed on the right side or the terminalconnection side of the sensor terminal unit 310, are arranged seriallyin a straight line extending in the up-down direction. The upper tie bar315 a connects the V1 sensor terminal 312 with the Vc sensor terminal311. Further, the middle tie bar 315 b connects the Vc sensor terminal311 with the V2 sensor terminal 313. Further, the lower tie bar 315 cconnects the V2 sensor terminal 313 with the GND sensor terminal 314.

Further, in the upper portion of the left side or the externalconnection, side of the Sensor terminal unit 310, the GNP sensorterminal 314, the V2 sensor terminal 313, the Vc sensor terminal 311,and the V1 sensor terminal 312 are arranged parallel in the left-rightdirection. Then, the tie bars 316 a, 316 b, 316 c in the upper portionof the left side or the external connection side of the sensor terminalunit 310 are arranged serially in a straight line extending in theleft-right direction. The left-side tie bar 316 a connects the GNDsensor terminal 314 with the V2 sensor terminal 313. Further, the middletie bar 316 b connects the V2 sensor terminal 313 with the Vc sensorterminal 311. Further, the right-side tie bar 316 c connects the Vcsensor terminal 311 with the V1 sensor terminal 312. Further, theadjacent portions of the GND sensor terminal 314 and the V2 sensorterminal 313 in the lower of the sensor terminal unit 310 are connectedby the tie bar 317.

Referring to FIG. 75, the Vc sensor terminal 311 includes the terminalconnection end 311 a provided at one end thereof or the right end of theterminal connection side, and the external connection end 311 b providedat the other end thereof or the left end of the external connectionside. The terminal connection end 311 a is formed to be connectable withthe terminal connection 261 a (see FIG. 73) of the Vc main terminal 261of the sensor assembly 300. Further, the external connection end 311 bis formed to be connectable with the corresponding terminal pin (notshown) of the unshown external connector. Further, the V1 sensorterminal 312 includes the terminal connection end 312 a provided at oneend thereof or the right end of the terminal connection side, and theexternal connection end 312 b provided at the other end thereof or theleft end of the external connection side. The terminal connection end312 a is formed to be connectable with the terminal connection 261 a(see FIG. 73) of the V1 main terminal 262 of the sensor assembly 300.Further, the external connection end 312 b is formed to be connectablewith the corresponding terminal pin (not shown) of the unshown externalconnector. Further, the V2 sensor terminal 313 includes the terminalconnection end 313 a provided at one end thereof or the right end of theterminal connection side, and the external connection end 313 b providedat the other end thereof or the left end of the external connectionside. The terminal connection end 313 a is formed to be connectable withthe terminal connection 263 a (see FIG. 73) of the V2 main terminal 263of the sensor assembly 300. Further, the external connection end 313 bis formed to be connectable with the corresponding terminal pin (notshown) of an unshown external connector. Further, the GND sensorterminal 314 includes the terminal connection end 314 a provided at oneend thereof or the right end of the terminal connection side, and theexternal connection end 314 b provided at the other end thereof or theleft end of the external connection side. The terminal connection end314 a extends in surrounding manner to the lower portion of the holdermember 90 in the sensor assembly 100 so as to be connectable with theterminal connection 264 a (see. FIG. 73) of the GND main terminal 264 inthe sensor assembly 300. Further, the external connection end 314 b isformed to be connectable with the corresponding terminal pin (not shown)of an unshown external connector.

Further, the external connection ends 311 b, 312 b, 313 b, 314 b of thesensor terminals 311, 312, 313, 314 extend upward in such a manner thatthe external connection end 312 b, the external connection end 311 b,the external connection end 313 b, the external connection end 314 b arearranged parallel in this order from the right to the left. It should benoted that the outer surface of the sensor terminal unit 310 is platedwith Ni (not shown), while each terminal connection end 311 a, 312 a,313 a, 314 a is plated with Au. Further, each sensor terminal 311, 312,313, 314 is provided with an appropriate number of through holes 311 h,312 h, 313 h, 314 h respectively (see FIGS. 75 and 76). When the cover230 (later described) is resin molded, each through hole 311 h, 312 h,313 h, 314 h is fitted with a positioning pin (not shown) of a moldingdie such that each sensor terminal 311, 312, 313, 314 is positioned inthe die. Similarly, each plate terminal 237, 238 is provided with anappropriate number of through holes 237 h, 238 h (see FIGS. 78 and 81).

The sensor terminal assembly 320 will now be described. FIG. 77 is afront view of the sensor terminal assembly. The sensor terminal assembly320 is configured such that the sensor terminal unit 300 (see FIG. 76)is implemented with the sensor assembly 300 (see FIGS. 73 and 74). Thus,as shown in FIG. 77, the terminal connection end 311 a of the Vc sensorterminal 311 of the sensor terminal unit 310 is electrically connectedon the terminal connection 261 a of the Vc main terminal 261 of thesensor assembly 300 by welding (not designated). Further, the terminalconnection end 312 a of the V1 sensor terminal 312 of the sensorterminal unit 310 is electrically connected on the terminal connection261 a of the Vc main terminal 261 of the sensor assembly 300 by welding(not designated). Further, the terminal connection end 313 a of the V2sensor terminal 313 of the sensor terminal unit 310 is electricallyconnected on the terminal connection 263 a of the V2 main terminal 263of the sensor assembly 300 by welding (the welded portion is designatedas 323). Further, the terminal connection end 314 a of the GND sensorterminal 314 of the sensor terminal unit 310 is electrically connectedon the terminal connection 264 a of the GND main terminal 264 of thesensor assembly 300 by welding (not designated). It should be noted thatwelding the main terminal with the sensor terminal might be performed,for example, by projection welding.

After the welding, each tie bar 315 a, 315 b, 315 c, 316 a, 316 b, 316c, 317 of the sensor terminal unit 310 is removed by cutting.Accordingly, as shown in FIG. 78, separated sensor terminals 311, 312,313, 314 are formed. The sensor terminals 311, 312, 313, 314 formed asabove are equivalent to the “subterminals” and the “external terminals”herein. It should be noted that FIG. 78 shows a front view of the sensorterminal assembly 320 in which the tie bars have been cut.

Then, the cover 230 will be described. As shown in FIG. 38, the cover230 is formed in such a way that the sensor terminal assembly 320 (seeFIG. 78), the plate terminals 237, 238 (see FIGS. 79 to 82), and therelay connectors 236 are insert molded or inserted to be resin molded.It should be noted that the sensor terminal assembly 320 in FIG. 38 is areversed image of the same in FIG. 78. Further, when the cover 230 isresin molded, the resin portion of the cover 230 surrounding the holdermember 290 of the sensor terminal assembly 320 is prevented from burringon a burring prevention surface 326 (see FIG. 39), which forms the sameplane as the end surface 292 a (see FIG. 66) of the intermediate endplate portion 292 of the holder member 90. It should be noted that, aspreviously described, “burring prevention” is also referred to as“burring cut.” This term refers to blocking a resin flow toward theexposed portion by the die 330 (see FIG. 83) fitting with the exposedportion such that a portion not buried by the resin portion (equivalentto the hollow tube portion 291 of the holder member 290 and the endsurface 292 a of the intermediate end plate portion 292 in thisembodiment) when the resin molding is performed. Then, the end surfaceof the resin portion, which is molded by the die 330 fitting to theexposed portion and surrounds the exposed portion, is referred to as a“burring prevention surface” (designated as 326). Further, referring toFIG. 83, the cavity for molding the cover 30 is defined by the die 330and the other die 332 to be matched to the die 330. Further, the endsurface 292 a of the intermediate end plate portion 292 of the holdermember 90 is equivalent to the “stepped surface,” which intersects anaxis of the holder member 290 and is provided on the outer surface ofthe holder 290. Further, since the resin portion of the cover 230 flowsinto the retaining recesses 295 provided on the end surface 292 a of theintermediate end plate portion 292 of the holder member 90, it ispossible to retain the holder member 290 on the cover 230.

Further, as shown in FIG. 38, the external connection ends 311 b, 312 b,313 b, 314 b of the sensor terminals 311, 312, 313, 314; as well as theexternal connection ends 237 b, 238 b of the plate terminals 237, 238project into the connector portion 240 of the cover 230 (see FIG. 37).Further, the external connection ends 237 b, 238 b, 311 b, 312 b, 313 b,314 b are arranged in a row in the left-right direction in FIG. 4. Itshould be noted that the external connection ends 238 b, 237 b, 314 b,313 b, 311 b, 312 b are arranged in this order from the left to theright in FIG. 37 in this embodiment. Further, as previously described,each external connection end 237 b, 238 b, 311 b, 312 b, 313 b, 314 b isconnectable with each terminal pin (not shown) within the externalconnector (not shown) connected with the connector portion 240. Asdescribed above, the sensor assembly 300 is provided with the sensorterminals 311, 312, 313, 314, the cover 230, the relay connectors 236,and the plate terminals 237, 238 such that the rotational angle sensorSe is configured (see FIGS. 38 and 39).

As shown in FIG. 35, the cover 230 configured as above is connected withthe lateral surface (the right-side surface as viewed in FIG. 35) of thethrottle body 1 so as to complete the throttle control device TC.Accordingly, similar to the first embodiment, the hollow tube portion291 of the holder member 290 of the rotational angle sensor Se isdisposed substantially concentric with the axis of the yoke 43 or therotational axis L of the throttle shaft 6 so as to be between themagnets 44, 45 and in a predetermined spaced relationship with eachmagnet (see FIGS. 35 and 39).

Functions and effects similar to those of the first embodiment are alsoobtained by the rotational angle sensor Se (see FIGS. 38 and 39)provided in the aforementioned throttle control device TC and the methodfor manufacturing the same, and the throttle control device TC (see FIG.35) with the rotational angle sensor Se. Additionally, since thecapacitors 281, 282, 283, 284 are disposed on the same side (the rightside in FIG. 58) as the connection side of the sensor ICs 250(1), 250(2)in the main terminals 261, 262, 263, 264, the sensor ICs 250(1), 250(2)and the capacitors 281, 282, 283, 284 are easily disposed against themain terminals 261, 262, 263, 264.

Additionally, the aforementioned rotational angle sensor Se isconfigured such that the capacitors 281, 282, 283, 284 are lead-typecapacitors 280 having leads 280 b, 280 c. Thus, the leads 280 b, 280 cof the capacitors 281, 282, 283, 284 can be retained by a jig 286 (seeFIGS. 61, 62, and 64) or by a jig 286 for retaining the main terminals261, 262, 263, 264, the sensor ICs 250(1), 250(2) and the like. Thus,since the capacitors 281, 282, 283, 284 are positioned, it is possibleto prevent or reduce connection failures caused by displacement of thecapacitors 281, 282, 283, 284, or connection failures of the leads 280b, 280 c against the main terminals 261, 262, 263, 264.

Further, the leads 280 b, 280 c of each capacitor 281, 282, 283, 284 areconnected with the IC terminal connections (the IC terminal connectionscombined with the capacitor connections) 261 c, 261 d, 262 c, 263 c, 264c, 264 e of the main terminals 261, 262, 263, 264 by welding. Thus,since the strength of the connection between the leads 280 b, 280 c ofeach capacitor 281, 282, 283, 284 and the IC terminal connections 261 c,261 d, 262 c, 263 c, 264 c, 264 e of the main terminals 261, 262, 263,264 is enhanced, it is possible to increase the reliability of therotational angle sensor Se. Further, compared with soldering in a reflowfurnace, welding enables simple welding facilities to be used withouthaving to use an expensive reflow furnace, so as to lower the cost.Further, soldering might cause connection failures due to uneven amountof solder, while welding can securely connect the leads 280 b, 280 c ofeach capacitor 281, 282, 283, 284 with the IC terminal connections 261c, 261 d, 262 c, 263 c, 264 c, 264 e of the main terminals 261, 262,263, 264.

Further, the bottom end surface 291 e or the bottom surface within theholder member 290 is formed with a predetermined spacing S along thecontour shape of each sensor IC 250(1), 250(2) facing to the bottom endsurface 291 e (see FIG. 70). Thus, a potting material 302 can easilyflow into a gap between the bottom end surface 291 e within the holdermember 290 and the sensor ICs 250(1), 250(2), i.e., a region prone tovoids when the potting material 302 is potted, such that it is possibleto inhibit void generation so as to prevent or reduce defective moldings(see FIG. 72).

Further, the reinforcing ribs 296 provided on both of the sidewalls 293a, 293 b included in the holder member 290 can inhibit deformation ofboth of the sidewalls 293 a, 293 b caused by molding pressure when thecover 230 is resin molded. Thus, it is possible to prevent or reducedefective moldings caused by deformation of both of the sidewalls 293 a,293 b of the holder member 290 when molding pressure is applied duringthe resin molding of the cover 230. It should be noted that thereinforcing ribs 296 may project from the outer surface of both of thesidewalls 293 a, 293 b.

Further, the resin portion of the over 230 surrounding the holder member290 is prevented from burring on the same plane as the stepped surfaceprovided in the holder member 290, or the stepped surface 292 a of theintermediate end plate portion 292. Thus, it is possible to inhibit burrgeneration, while high dimensional accuracy is not required between theholder member 290 and the resin molding die 330 (see FIG. 83) for thecover 230. Therefore, it is possible to lower the cost for ensuring thedimensional accuracy of the holder member 290. More specific in thisrespect, when the resin portion of the cover 230 is to be prevented fromburring, for example, on the outer surface of the hollow tube portion291 of the holder member 290, unless a gap between the hollow tubeportion 291 and the die fitting to the hollow tube portion 291 isaccurately configured, some burring may occur due to resin leaking fromthe gap. At the same time, if the resin portion of the cover 230 isprevented from burring on the same plane as the end surface 292 a of theintermediate end plate portion 292 of the holder member 290, it will bepossible to avoid the resin leaking from the gap between the hollow tubeportion 291 and the die 330 (see FIG. 83) fitting to the hollow tubeportion 291. Thus, it is possible to inhibit burr generation, while highdimensional accuracy is not required between the holder member 290 andthe resin molding die 330 (see FIG. 83) for the cover 230. Therefore, itis possible to lower the cost for ensuring the dimensional accuracy ofthe holder member 290.

Further, the end surface 292 a of the intermediate end plate portion 292of the holder member 290 is provided with the retaining recesses 295into which the resin portion of the cover 230 flows. Thus, since theresin portion of the cover 230 flows into the retaining recesses 295 ofthe holder member 290, it is possible to retain the holder member 290 onthe cover 230.

Further, according to the aforementioned method for manufacturing therotational angle sensor Se, the connections between the main terminalunit 260 and the connection terminals 255, 256, 257 of the sensor ICs250(1), 250(2) are disposed in a row, while the welding head 297 (seeFIG. 63) can be sequentially moved in the row direction as eachconnection terminal 255, 256, 257 of each sensor IC 250(1), 250(2) iswelded with each main terminal 261, 262, 263, 264. In this embodiment,as shown by arrow Y in FIG. 61, the welding is performed inreciprocating manner in upper-and-lower two rows. Therefore, since themovement of the welding head 297 of the welding facility can besimplified, it is possible to use a simple welding facility so as tolower the cost.

The present invention may not be limited to the aforementionedembodiments, but may be modified without departing from the scope of thepresent invention. For example, in the magnetic detector, as long as thestrength or direction of the magnetic field between a pair of magnets44, 45 can be detected, it is possible to use a magnetic detectionelement such as a magnetoresistive element, a hall element and the like,a magnetic detector in which the magnetic sensing portion having amagnetic detection element is connected with the computing portion, andthe like, instead of using each sensor IC. Further, the type of themagnets 44, 45 may not be limited to ferrite magnets. Further, therotational angle sensor Se may not be limited to be used in the throttlecontrol device TC, but may be diverted into a rotational angle sensorfor another rotor. Further, in the aforementioned embodiments, theholder member is to house the magnetic detector and themagnetic-detector-side connection portions of the main terminals.However, the holder member may not be a holder member housing them aslong as to be able to retain them. For example, in the case that themagnetic detector is integrated into the holder member by resininjection molding, the holder member molded in a column shape can retainthe magnetic detector. Further, each connection terminal of the magneticdetector can be connected with the main terminals not only by weldingbut, for example, also by soldering. Further, a resin mold may be usedinstead of the potting material. Further, the leads of the capacitor canbe connected with the capacitor connections of the main terminals notonly by welding but, for example, also by soldering. Further, theretaining recesses of the holder member can be provided in a portiondifferent from the stepped portion.

The invention claimed is:
 1. A rotational angle sensor comprising: afirst sensor integrated circuit including a first magnetic sensingportion, a first computing portion and first connecting terminals,wherein the first magnetic sensing portion and the first computingportion are connected to each other by the first connecting terminals;and a second sensor integrated circuit including a second magneticsensing portion, a second computing portion and second connectingterminals, wherein the second magnetic sensing portion and the secondcomputing portion are connected to each other by the second connectingterminals, wherein the first magnetic sensing portion is inclined at anangle of approximately 90 degrees with respect to the first computingportion toward a rear side of the first computing portion, wherein thesecond magnetic sensing portion is inclined at an angle of approximately90 degrees with respect to the second computing portion toward a frontside of the second computing portion, and wherein the first sensorintegrated circuit and the second sensor integrated circuit are disposedsuch that the rear side of the first computing portion is opposite thefront side of the second computing portion, and such that the firstmagnetic sensing portion and the second magnetic sensing portion overlapwith each other.
 2. The rotational angle sensor according to claim 1further comprising a casing member, wherein the first sensor integratedcircuit and the second sensor integrated circuit are housed in thecasing member.
 3. The rotational angle sensor according to claim 2,wherein the first sensor integrated circuit and the second sensorintegrated circuit are buried with a resin in the casing member.
 4. Therotational angle sensor according to claim 3, wherein the resin is apotting material.
 5. The rotational angle sensor according to claim 2,wherein the casing member is a holder member for holding the firstmagnetic sensing portion and the second magnetic sensing portion.
 6. Therotational angle sensor according to claim 1, further comprising: aholder member for holding the first magnetic sensing portion and thesecond magnetic sensing portion, wherein the first magnetic sensingportion is provided with two first positioning pieces projecting fromboth sides of the first magnetic sensing portion, and wherein the secondmagnetic sensing portion is provided with two second positioning piecesprojecting from both sides of the second magnetic sensing portion, andwherein the holder member is provided with two positioning grooves, andthe positioning grooves are configured to receive the two firstpositioning pieces and the two second positioning pieces so as toposition the first magnetic sensing portion and the second magneticsensing portion to a predetermined position.
 7. The rotational anglesensor according to claim 6, wherein the holder member is configured tohouse the first sensor integrated circuit and the second sensorintegrated circuit.
 8. The rotational angle sensor according to claim 1,wherein the first and second computing portions are opposed to eachother with respect to a rotational axis of a sensing target.
 9. Therotational angle sensor according to claim 1, wherein the first andsecond magnetic sensing portions overlap with each other in a directionof a rotational axis of a sensing target.
 10. The rotational anglesensor according to claim 1, wherein sides of the first magnetic portionand second magnetic portion contact each other.